JPS494980A - - Google Patents

Info

Publication number
JPS494980A
JPS494980A JP4159372A JP4159372A JPS494980A JP S494980 A JPS494980 A JP S494980A JP 4159372 A JP4159372 A JP 4159372A JP 4159372 A JP4159372 A JP 4159372A JP S494980 A JPS494980 A JP S494980A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4159372A
Other languages
Japanese (ja)
Other versions
JPS5113618B2 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP4159372A priority Critical patent/JPS5113618B2/ja
Publication of JPS494980A publication Critical patent/JPS494980A/ja
Publication of JPS5113618B2 publication Critical patent/JPS5113618B2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • H10W72/541Dispositions of bond wires
    • H10W72/5449Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Wire Bonding (AREA)
JP4159372A 1972-04-25 1972-04-25 Expired JPS5113618B2 (https=)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4159372A JPS5113618B2 (https=) 1972-04-25 1972-04-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4159372A JPS5113618B2 (https=) 1972-04-25 1972-04-25

Publications (2)

Publication Number Publication Date
JPS494980A true JPS494980A (https=) 1974-01-17
JPS5113618B2 JPS5113618B2 (https=) 1976-05-01

Family

ID=12612696

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4159372A Expired JPS5113618B2 (https=) 1972-04-25 1972-04-25

Country Status (1)

Country Link
JP (1) JPS5113618B2 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56145105U (https=) * 1980-04-02 1981-11-02

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5427507U (https=) * 1977-07-27 1979-02-22
JPS6124513U (ja) * 1984-07-20 1986-02-13 竹一 三根 内側締つけフツクボルト
JPS61137716U (https=) * 1985-02-16 1986-08-27

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56145105U (https=) * 1980-04-02 1981-11-02

Also Published As

Publication number Publication date
JPS5113618B2 (https=) 1976-05-01

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