JPS494980A - - Google Patents

Info

Publication number
JPS494980A
JPS494980A JP4159372A JP4159372A JPS494980A JP S494980 A JPS494980 A JP S494980A JP 4159372 A JP4159372 A JP 4159372A JP 4159372 A JP4159372 A JP 4159372A JP S494980 A JPS494980 A JP S494980A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4159372A
Other languages
Japanese (ja)
Other versions
JPS5113618B2 (enExample
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP4159372A priority Critical patent/JPS5113618B2/ja
Publication of JPS494980A publication Critical patent/JPS494980A/ja
Publication of JPS5113618B2 publication Critical patent/JPS5113618B2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • H10W72/541Dispositions of bond wires
    • H10W72/5449Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Wire Bonding (AREA)
JP4159372A 1972-04-25 1972-04-25 Expired JPS5113618B2 (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4159372A JPS5113618B2 (enExample) 1972-04-25 1972-04-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4159372A JPS5113618B2 (enExample) 1972-04-25 1972-04-25

Publications (2)

Publication Number Publication Date
JPS494980A true JPS494980A (enExample) 1974-01-17
JPS5113618B2 JPS5113618B2 (enExample) 1976-05-01

Family

ID=12612696

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4159372A Expired JPS5113618B2 (enExample) 1972-04-25 1972-04-25

Country Status (1)

Country Link
JP (1) JPS5113618B2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56145105U (enExample) * 1980-04-02 1981-11-02

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5427507U (enExample) * 1977-07-27 1979-02-22
JPS6124513U (ja) * 1984-07-20 1986-02-13 竹一 三根 内側締つけフツクボルト
JPS61137716U (enExample) * 1985-02-16 1986-08-27

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56145105U (enExample) * 1980-04-02 1981-11-02

Also Published As

Publication number Publication date
JPS5113618B2 (enExample) 1976-05-01

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