JPS4947587B1 - - Google Patents

Info

Publication number
JPS4947587B1
JPS4947587B1 JP45016823A JP1682370A JPS4947587B1 JP S4947587 B1 JPS4947587 B1 JP S4947587B1 JP 45016823 A JP45016823 A JP 45016823A JP 1682370 A JP1682370 A JP 1682370A JP S4947587 B1 JPS4947587 B1 JP S4947587B1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP45016823A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP45016823A priority Critical patent/JPS4947587B1/ja
Priority to US117330A priority patent/US3684931A/en
Priority to NLAANVRAGE7102350,A priority patent/NL169122C/xx
Priority to DE19712108645 priority patent/DE2108645C/de
Priority to GB2259971A priority patent/GB1302987A/en
Publication of JPS4947587B1 publication Critical patent/JPS4947587B1/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/90Bond pads, in general

Landscapes

  • Wire Bonding (AREA)
JP45016823A 1970-02-26 1970-02-26 Pending JPS4947587B1 (https=)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP45016823A JPS4947587B1 (https=) 1970-02-26 1970-02-26
US117330A US3684931A (en) 1970-02-26 1971-02-22 Semiconductor device with coplanar electrodes also overlying lateral surfaces thereof
NLAANVRAGE7102350,A NL169122C (nl) 1970-02-26 1971-02-22 Halfgeleiderelement, omvattende een halfgeleiderplaatje met een door een isolerende laag bedekt hoofdvlak en met elektroden die zich ononderbroken uitstrekken over delen van de isolerende laag en aangrenzende delen van zijvlakken van het halfgeleiderplaatje, alsmede werkwijze voor het bevestigen van het halfgeleiderelement op een van aansluitklemmen voorziene montageplaat.
DE19712108645 DE2108645C (de) 1970-02-26 1971-02-24 Halbleiterbauelement
GB2259971A GB1302987A (https=) 1970-02-26 1971-04-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP45016823A JPS4947587B1 (https=) 1970-02-26 1970-02-26

Publications (1)

Publication Number Publication Date
JPS4947587B1 true JPS4947587B1 (https=) 1974-12-17

Family

ID=11926881

Family Applications (1)

Application Number Title Priority Date Filing Date
JP45016823A Pending JPS4947587B1 (https=) 1970-02-26 1970-02-26

Country Status (1)

Country Link
JP (1) JPS4947587B1 (https=)

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