JPS4945687A - - Google Patents
Info
- Publication number
- JPS4945687A JPS4945687A JP47087587A JP8758772A JPS4945687A JP S4945687 A JPS4945687 A JP S4945687A JP 47087587 A JP47087587 A JP 47087587A JP 8758772 A JP8758772 A JP 8758772A JP S4945687 A JPS4945687 A JP S4945687A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/0198—Manufacture or treatment batch processes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP47087587A JPS4945687A (Direct) | 1972-09-02 | 1972-09-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP47087587A JPS4945687A (Direct) | 1972-09-02 | 1972-09-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS4945687A true JPS4945687A (Direct) | 1974-05-01 |
Family
ID=13919119
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP47087587A Pending JPS4945687A (Direct) | 1972-09-02 | 1972-09-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS4945687A (Direct) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS543813A (en) * | 1977-06-10 | 1979-01-12 | Shinagawa Refractories Co | Clayybased refractory and method of making same |
| US10445580B2 (en) * | 2016-09-30 | 2019-10-15 | Fujifilm Corporation | Image extraction system, image extraction method, and image extraction program |
-
1972
- 1972-09-02 JP JP47087587A patent/JPS4945687A/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS543813A (en) * | 1977-06-10 | 1979-01-12 | Shinagawa Refractories Co | Clayybased refractory and method of making same |
| US10445580B2 (en) * | 2016-09-30 | 2019-10-15 | Fujifilm Corporation | Image extraction system, image extraction method, and image extraction program |