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Priority to JP1972084846UpriorityCriticalpatent/JPS5332533Y2/ja
Publication of JPS4944157UpublicationCriticalpatent/JPS4944157U/ja
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Publication of JPS5332533Y2publicationCriticalpatent/JPS5332533Y2/ja
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
H01L24/02—Bonding areas ; Manufacturing methods related thereto
H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area