JPS4943063B1 - - Google Patents

Info

Publication number
JPS4943063B1
JPS4943063B1 JP45027504A JP2750470A JPS4943063B1 JP S4943063 B1 JPS4943063 B1 JP S4943063B1 JP 45027504 A JP45027504 A JP 45027504A JP 2750470 A JP2750470 A JP 2750470A JP S4943063 B1 JPS4943063 B1 JP S4943063B1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP45027504A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS4943063B1 publication Critical patent/JPS4943063B1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
    • C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
    • C23C18/1837—Multistep pretreatment
    • C23C18/1844—Multistep pretreatment with use of organic or inorganic compounds other than metals, first

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Chemically Coating (AREA)
  • ing And Chemical Polishing (AREA)
  • Electroplating Methods And Accessories (AREA)
JP45027504A 1969-04-02 1970-04-02 Pending JPS4943063B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US812901A US3666529A (en) 1969-04-02 1969-04-02 Method of conditioning aluminous surfaces for the reception of electroless nickel plating

Publications (1)

Publication Number Publication Date
JPS4943063B1 true JPS4943063B1 (en) 1974-11-19

Family

ID=25210917

Family Applications (1)

Application Number Title Priority Date Filing Date
JP45027504A Pending JPS4943063B1 (en) 1969-04-02 1970-04-02

Country Status (6)

Country Link
US (1) US3666529A (en)
JP (1) JPS4943063B1 (en)
DE (1) DE2014285C3 (en)
FR (1) FR2042270A5 (en)
GB (1) GB1251314A (en)
IL (1) IL34111A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5196955U (en) * 1975-01-31 1976-08-04
JPS5681754U (en) * 1979-11-30 1981-07-02

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3765994A (en) * 1971-12-07 1973-10-16 Horizons Inc Indicia bearing, anodized laminated articles
USRE28506E (en) * 1971-12-07 1975-08-05 Indicia bearing anodized aluminum articles
USRE33767E (en) * 1971-12-15 1991-12-10 Surface Technology, Inc. Method for concomitant particulate diamond deposition in electroless plating, and the product thereof
US4013492A (en) * 1975-10-21 1977-03-22 Edgar Avinell Raeger Method of simultaneously plating dissimilar metals
US4122215A (en) * 1976-12-27 1978-10-24 Bell Telephone Laboratories, Incorporated Electroless deposition of nickel on a masked aluminum surface
US4419390A (en) * 1977-06-06 1983-12-06 Nathan Feldstein Method for rendering non-platable semiconductor substrates platable
US4228201A (en) * 1977-06-06 1980-10-14 Nathan Feldstein Method for rendering a non-platable semiconductor substrate platable
US4328266A (en) * 1977-06-06 1982-05-04 Surface Technology, Inc. Method for rendering non-platable substrates platable
US4305997A (en) * 1977-06-06 1981-12-15 Surface Technology, Inc. Electrolessly metallized product of non-catalytic metal or alloy
US4355083A (en) * 1977-06-06 1982-10-19 Nathan Feldstein Electrolessly metallized silver coated article
US4181760A (en) * 1977-06-06 1980-01-01 Surface Technology, Inc. Method for rendering non-platable surfaces platable
FR2421452A1 (en) * 1978-03-31 1979-10-26 Pechiney Aluminium NEW METHOD FOR MAKING ELECTRICAL CONTACTS ON ALUMINUM PARTS
US4400415A (en) * 1981-08-13 1983-08-23 Lea Ronal, Inc. Process for nickel plating aluminum and aluminum alloys
US4374002A (en) * 1982-03-04 1983-02-15 The United States Of America As Represented By The United States Department Of Energy Method for producing highly reflective metal surfaces
US4567066A (en) * 1983-08-22 1986-01-28 Enthone, Incorporated Electroless nickel plating of aluminum
US4840820A (en) * 1983-08-22 1989-06-20 Enthone, Incorporated Electroless nickel plating of aluminum
US4954370A (en) * 1988-12-21 1990-09-04 International Business Machines Corporation Electroless plating of nickel on anodized aluminum
CA2178146C (en) * 1995-06-06 2002-01-15 Mark W. Zitko Electroless nickel cobalt phosphorous composition and plating process
KR101056544B1 (en) * 2003-08-19 2011-08-11 아반토르 퍼포먼스 머티리얼스, 인크. Peeling and Cleaning Compositions for Microelectronic Substrates
DE102011115802B4 (en) * 2011-10-12 2015-03-12 C. Hafner Gmbh + Co. Kg Process for the corrosion protection treatment of a workpiece made of an aluminum material, in particular of an aluminum wrought alloy
CN111893464A (en) * 2020-07-27 2020-11-06 西安工业大学 Preparation method for plating Ni-P film on surface of aluminum alloy substrate
WO2023105072A1 (en) 2021-12-09 2023-06-15 Atotech Deutschland GmbH & Co. KG Use of an aqueous alkaline composition for the electroless deposition of a metal or metal alloy on a metal surface of a substrate

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5196955U (en) * 1975-01-31 1976-08-04
JPS5681754U (en) * 1979-11-30 1981-07-02

Also Published As

Publication number Publication date
DE2014285A1 (en) 1970-10-29
GB1251314A (en) 1971-10-27
FR2042270A5 (en) 1971-02-05
DE2014285B2 (en) 1977-09-08
US3666529A (en) 1972-05-30
IL34111A0 (en) 1970-07-19
DE2014285C3 (en) 1978-06-08
IL34111A (en) 1973-04-30

Similar Documents

Publication Publication Date Title
AU2270770A (en)
FR2042270A5 (en)
FR2051687B1 (en)
AU465452B2 (en)
AU450150B2 (en)
CS148395B1 (en)
AU2355770A (en)
AU427401B2 (en)
AU470301B1 (en)
AU410358B2 (en)
AU428074B2 (en)
AU442535B2 (en)
AU442463B2 (en)
AU428129B2 (en)
AT308690B (en)
AU442380B2 (en)
AU442322B2 (en)
AU414607B2 (en)
AU442554B2 (en)
AU417208B2 (en)
AU428131B2 (en)
AU470661B1 (en)
AU442538B2 (en)
AU425297B2 (en)
AR203167Q (en)