JPS4942623B1 - - Google Patents

Info

Publication number
JPS4942623B1
JPS4942623B1 JP9600970A JP9600970A JPS4942623B1 JP S4942623 B1 JPS4942623 B1 JP S4942623B1 JP 9600970 A JP9600970 A JP 9600970A JP 9600970 A JP9600970 A JP 9600970A JP S4942623 B1 JPS4942623 B1 JP S4942623B1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9600970A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS4942623B1 publication Critical patent/JPS4942623B1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1605—Process or apparatus coating on selected surface areas by masking
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/428—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates having a metal pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0542—Continuous temporary metal layer over metal pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0588—Second resist used as pattern over first resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1377—Protective layers
    • H05K2203/1394—Covering open PTHs, e.g. by dry film resist or by metal disc
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • ing And Chemical Polishing (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
JP9600970A 1969-12-17 1970-11-02 Pending JPS4942623B1 (enrdf_load_stackoverflow)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US88577169A 1969-12-17 1969-12-17

Publications (1)

Publication Number Publication Date
JPS4942623B1 true JPS4942623B1 (enrdf_load_stackoverflow) 1974-11-15

Family

ID=25387658

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9600970A Pending JPS4942623B1 (enrdf_load_stackoverflow) 1969-12-17 1970-11-02

Country Status (4)

Country Link
JP (1) JPS4942623B1 (enrdf_load_stackoverflow)
DE (1) DE2062171A1 (enrdf_load_stackoverflow)
FR (1) FR2068814B1 (enrdf_load_stackoverflow)
GB (1) GB1258728A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102247662B1 (ko) * 2021-01-29 2021-05-03 주식회사 아이코드랩 만화의 스케치 이미지를 자동으로 채색하기 위한 장치 및 방법

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102247662B1 (ko) * 2021-01-29 2021-05-03 주식회사 아이코드랩 만화의 스케치 이미지를 자동으로 채색하기 위한 장치 및 방법

Also Published As

Publication number Publication date
GB1258728A (enrdf_load_stackoverflow) 1971-12-30
FR2068814A1 (enrdf_load_stackoverflow) 1971-09-03
FR2068814B1 (enrdf_load_stackoverflow) 1976-03-12
DE2062171A1 (de) 1971-06-24

Similar Documents

Publication Publication Date Title
AU465452B2 (enrdf_load_stackoverflow)
AU429630B2 (enrdf_load_stackoverflow)
AU450150B2 (enrdf_load_stackoverflow)
AU442375B2 (enrdf_load_stackoverflow)
AU2355770A (enrdf_load_stackoverflow)
AU427401B2 (enrdf_load_stackoverflow)
AU470301B1 (enrdf_load_stackoverflow)
AU442535B2 (enrdf_load_stackoverflow)
AU442463B2 (enrdf_load_stackoverflow)
AU428074B2 (enrdf_load_stackoverflow)
AU428129B2 (enrdf_load_stackoverflow)
AU428131B2 (enrdf_load_stackoverflow)
AU417208B2 (enrdf_load_stackoverflow)
AU470661B1 (enrdf_load_stackoverflow)
AU438128B2 (enrdf_load_stackoverflow)
AU425297B2 (enrdf_load_stackoverflow)
AU442285B2 (enrdf_load_stackoverflow)
AU442322B2 (enrdf_load_stackoverflow)
AU442357B2 (enrdf_load_stackoverflow)
AU414607B2 (enrdf_load_stackoverflow)
AU410358B2 (enrdf_load_stackoverflow)
AU442554B2 (enrdf_load_stackoverflow)
AU5228269A (enrdf_load_stackoverflow)
AU5598769A (enrdf_load_stackoverflow)
AR203167Q (enrdf_load_stackoverflow)