JPS4942281A - - Google Patents

Info

Publication number
JPS4942281A
JPS4942281A JP2251972A JP2251972A JPS4942281A JP S4942281 A JPS4942281 A JP S4942281A JP 2251972 A JP2251972 A JP 2251972A JP 2251972 A JP2251972 A JP 2251972A JP S4942281 A JPS4942281 A JP S4942281A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2251972A
Other languages
Japanese (ja)
Other versions
JPS5128500B2 (enrdf_load_html_response
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP47022519A priority Critical patent/JPS5128500B2/ja
Publication of JPS4942281A publication Critical patent/JPS4942281A/ja
Publication of JPS5128500B2 publication Critical patent/JPS5128500B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP47022519A 1972-03-03 1972-03-03 Expired JPS5128500B2 (enrdf_load_html_response)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP47022519A JPS5128500B2 (enrdf_load_html_response) 1972-03-03 1972-03-03

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP47022519A JPS5128500B2 (enrdf_load_html_response) 1972-03-03 1972-03-03

Publications (2)

Publication Number Publication Date
JPS4942281A true JPS4942281A (enrdf_load_html_response) 1974-04-20
JPS5128500B2 JPS5128500B2 (enrdf_load_html_response) 1976-08-19

Family

ID=12085005

Family Applications (1)

Application Number Title Priority Date Filing Date
JP47022519A Expired JPS5128500B2 (enrdf_load_html_response) 1972-03-03 1972-03-03

Country Status (1)

Country Link
JP (1) JPS5128500B2 (enrdf_load_html_response)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS554985A (en) * 1978-06-27 1980-01-14 Nec Kyushu Ltd Lead frame for semiconductor device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4947980A (enrdf_load_html_response) * 1972-09-13 1974-05-09

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4947980A (enrdf_load_html_response) * 1972-09-13 1974-05-09

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS554985A (en) * 1978-06-27 1980-01-14 Nec Kyushu Ltd Lead frame for semiconductor device

Also Published As

Publication number Publication date
JPS5128500B2 (enrdf_load_html_response) 1976-08-19

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