JPS4942281A - - Google Patents

Info

Publication number
JPS4942281A
JPS4942281A JP2251972A JP2251972A JPS4942281A JP S4942281 A JPS4942281 A JP S4942281A JP 2251972 A JP2251972 A JP 2251972A JP 2251972 A JP2251972 A JP 2251972A JP S4942281 A JPS4942281 A JP S4942281A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2251972A
Other languages
Japanese (ja)
Other versions
JPS5128500B2 (cs
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP47022519A priority Critical patent/JPS5128500B2/ja
Publication of JPS4942281A publication Critical patent/JPS4942281A/ja
Publication of JPS5128500B2 publication Critical patent/JPS5128500B2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP47022519A 1972-03-03 1972-03-03 Expired JPS5128500B2 (cs)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP47022519A JPS5128500B2 (cs) 1972-03-03 1972-03-03

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP47022519A JPS5128500B2 (cs) 1972-03-03 1972-03-03

Publications (2)

Publication Number Publication Date
JPS4942281A true JPS4942281A (cs) 1974-04-20
JPS5128500B2 JPS5128500B2 (cs) 1976-08-19

Family

ID=12085005

Family Applications (1)

Application Number Title Priority Date Filing Date
JP47022519A Expired JPS5128500B2 (cs) 1972-03-03 1972-03-03

Country Status (1)

Country Link
JP (1) JPS5128500B2 (cs)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS554985A (en) * 1978-06-27 1980-01-14 Nec Kyushu Ltd Lead frame for semiconductor device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4947980A (cs) * 1972-09-13 1974-05-09

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4947980A (cs) * 1972-09-13 1974-05-09

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS554985A (en) * 1978-06-27 1980-01-14 Nec Kyushu Ltd Lead frame for semiconductor device

Also Published As

Publication number Publication date
JPS5128500B2 (cs) 1976-08-19

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