JPS4941955A - - Google Patents

Info

Publication number
JPS4941955A
JPS4941955A JP8238172A JP8238172A JPS4941955A JP S4941955 A JPS4941955 A JP S4941955A JP 8238172 A JP8238172 A JP 8238172A JP 8238172 A JP8238172 A JP 8238172A JP S4941955 A JPS4941955 A JP S4941955A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8238172A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8238172A priority Critical patent/JPS4941955A/ja
Publication of JPS4941955A publication Critical patent/JPS4941955A/ja
Pending legal-status Critical Current

Links

Landscapes

  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
JP8238172A 1972-08-17 1972-08-17 Pending JPS4941955A (US06650917-20031118-M00005.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8238172A JPS4941955A (US06650917-20031118-M00005.png) 1972-08-17 1972-08-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8238172A JPS4941955A (US06650917-20031118-M00005.png) 1972-08-17 1972-08-17

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2315478A Division JPS53107767A (en) 1978-02-28 1978-02-28 Air-cooled heat pump type cooling/heating device

Publications (1)

Publication Number Publication Date
JPS4941955A true JPS4941955A (US06650917-20031118-M00005.png) 1974-04-19

Family

ID=13772988

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8238172A Pending JPS4941955A (US06650917-20031118-M00005.png) 1972-08-17 1972-08-17

Country Status (1)

Country Link
JP (1) JPS4941955A (US06650917-20031118-M00005.png)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51141460U (US06650917-20031118-M00005.png) * 1975-05-08 1976-11-15
JPS5316945A (en) * 1976-07-29 1978-02-16 Matsushita Electric Ind Co Ltd Cooling and heating device
JPS5373865U (US06650917-20031118-M00005.png) * 1976-11-19 1978-06-20
JPS53107767A (en) * 1978-02-28 1978-09-20 Daikin Ind Ltd Air-cooled heat pump type cooling/heating device
JPS53120373A (en) * 1977-03-30 1978-10-20 Hitachi Ltd Molded type element
JPS61258716A (ja) * 1985-05-13 1986-11-17 Japan Steel Works Ltd:The 射出成形における電子部品の金型装着方法およびその金型
JPS62282451A (ja) * 1986-05-30 1987-12-08 Mitsubishi Electric Corp 樹脂封止形半導体装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3529659A (en) * 1968-04-17 1970-09-22 Allen Trask Defrosting system for heat pumps

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3529659A (en) * 1968-04-17 1970-09-22 Allen Trask Defrosting system for heat pumps

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51141460U (US06650917-20031118-M00005.png) * 1975-05-08 1976-11-15
JPS5316945A (en) * 1976-07-29 1978-02-16 Matsushita Electric Ind Co Ltd Cooling and heating device
JPS605863B2 (ja) * 1976-07-29 1985-02-14 松下電器産業株式会社 冷暖房装置
JPS5373865U (US06650917-20031118-M00005.png) * 1976-11-19 1978-06-20
JPS5552686Y2 (US06650917-20031118-M00005.png) * 1976-11-19 1980-12-06
JPS53120373A (en) * 1977-03-30 1978-10-20 Hitachi Ltd Molded type element
JPS53107767A (en) * 1978-02-28 1978-09-20 Daikin Ind Ltd Air-cooled heat pump type cooling/heating device
JPS61258716A (ja) * 1985-05-13 1986-11-17 Japan Steel Works Ltd:The 射出成形における電子部品の金型装着方法およびその金型
JPH038930B2 (US06650917-20031118-M00005.png) * 1985-05-13 1991-02-07 Japan Steel Works Ltd
JPS62282451A (ja) * 1986-05-30 1987-12-08 Mitsubishi Electric Corp 樹脂封止形半導体装置

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