JPS4940673A - - Google Patents

Info

Publication number
JPS4940673A
JPS4940673A JP8393572A JP8393572A JPS4940673A JP S4940673 A JPS4940673 A JP S4940673A JP 8393572 A JP8393572 A JP 8393572A JP 8393572 A JP8393572 A JP 8393572A JP S4940673 A JPS4940673 A JP S4940673A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8393572A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8393572A priority Critical patent/JPS4940673A/ja
Publication of JPS4940673A publication Critical patent/JPS4940673A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
JP8393572A 1972-08-22 1972-08-22 Pending JPS4940673A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8393572A JPS4940673A (en) 1972-08-22 1972-08-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8393572A JPS4940673A (en) 1972-08-22 1972-08-22

Publications (1)

Publication Number Publication Date
JPS4940673A true JPS4940673A (en) 1974-04-16

Family

ID=13816439

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8393572A Pending JPS4940673A (en) 1972-08-22 1972-08-22

Country Status (1)

Country Link
JP (1) JPS4940673A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56105643A (en) * 1980-01-17 1981-08-22 Siemens Ag Method of assembling container with semiconductor device
JPS59101878A (en) * 1982-12-01 1984-06-12 Nec Corp Semiconductor device
JPS63110751A (en) * 1986-10-29 1988-05-16 Sony Corp Formation of solder pad

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56105643A (en) * 1980-01-17 1981-08-22 Siemens Ag Method of assembling container with semiconductor device
JPS59101878A (en) * 1982-12-01 1984-06-12 Nec Corp Semiconductor device
JPS63110751A (en) * 1986-10-29 1988-05-16 Sony Corp Formation of solder pad
JP2508432B2 (en) * 1986-10-29 1996-06-19 ソニー株式会社 Solder electrode formation method

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