JPS4940363U - - Google Patents

Info

Publication number
JPS4940363U
JPS4940363U JP1972082141U JP8214172U JPS4940363U JP S4940363 U JPS4940363 U JP S4940363U JP 1972082141 U JP1972082141 U JP 1972082141U JP 8214172 U JP8214172 U JP 8214172U JP S4940363 U JPS4940363 U JP S4940363U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1972082141U
Other languages
Japanese (ja)
Other versions
JPS5132364Y2 (xx
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1972082141U priority Critical patent/JPS5132364Y2/ja
Publication of JPS4940363U publication Critical patent/JPS4940363U/ja
Application granted granted Critical
Publication of JPS5132364Y2 publication Critical patent/JPS5132364Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73251Location after the connecting process on different surfaces
    • H01L2224/73253Bump and layer connectors

Landscapes

  • Bipolar Transistors (AREA)
  • Thyristors (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP1972082141U 1972-07-13 1972-07-13 Expired JPS5132364Y2 (xx)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1972082141U JPS5132364Y2 (xx) 1972-07-13 1972-07-13

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1972082141U JPS5132364Y2 (xx) 1972-07-13 1972-07-13

Publications (2)

Publication Number Publication Date
JPS4940363U true JPS4940363U (xx) 1974-04-09
JPS5132364Y2 JPS5132364Y2 (xx) 1976-08-12

Family

ID=27989320

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1972082141U Expired JPS5132364Y2 (xx) 1972-07-13 1972-07-13

Country Status (1)

Country Link
JP (1) JPS5132364Y2 (xx)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4921983A (xx) * 1972-06-19 1974-02-26

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4921983A (xx) * 1972-06-19 1974-02-26

Also Published As

Publication number Publication date
JPS5132364Y2 (xx) 1976-08-12

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