JPS4940363U - - Google Patents

Info

Publication number
JPS4940363U
JPS4940363U JP1972082141U JP8214172U JPS4940363U JP S4940363 U JPS4940363 U JP S4940363U JP 1972082141 U JP1972082141 U JP 1972082141U JP 8214172 U JP8214172 U JP 8214172U JP S4940363 U JPS4940363 U JP S4940363U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1972082141U
Other languages
Japanese (ja)
Other versions
JPS5132364Y2 (enrdf_load_html_response
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1972082141U priority Critical patent/JPS5132364Y2/ja
Publication of JPS4940363U publication Critical patent/JPS4940363U/ja
Application granted granted Critical
Publication of JPS5132364Y2 publication Critical patent/JPS5132364Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors

Landscapes

  • Die Bonding (AREA)
  • Bipolar Transistors (AREA)
  • Thyristors (AREA)
  • Wire Bonding (AREA)
JP1972082141U 1972-07-13 1972-07-13 Expired JPS5132364Y2 (enrdf_load_html_response)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1972082141U JPS5132364Y2 (enrdf_load_html_response) 1972-07-13 1972-07-13

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1972082141U JPS5132364Y2 (enrdf_load_html_response) 1972-07-13 1972-07-13

Publications (2)

Publication Number Publication Date
JPS4940363U true JPS4940363U (enrdf_load_html_response) 1974-04-09
JPS5132364Y2 JPS5132364Y2 (enrdf_load_html_response) 1976-08-12

Family

ID=27989320

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1972082141U Expired JPS5132364Y2 (enrdf_load_html_response) 1972-07-13 1972-07-13

Country Status (1)

Country Link
JP (1) JPS5132364Y2 (enrdf_load_html_response)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4921983A (enrdf_load_html_response) * 1972-06-19 1974-02-26

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4921983A (enrdf_load_html_response) * 1972-06-19 1974-02-26

Also Published As

Publication number Publication date
JPS5132364Y2 (enrdf_load_html_response) 1976-08-12

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