JPS4939934B1 - - Google Patents
Info
- Publication number
- JPS4939934B1 JPS4939934B1 JP44101321A JP10132169A JPS4939934B1 JP S4939934 B1 JPS4939934 B1 JP S4939934B1 JP 44101321 A JP44101321 A JP 44101321A JP 10132169 A JP10132169 A JP 10132169A JP S4939934 B1 JPS4939934 B1 JP S4939934B1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP44101321A JPS4939934B1 (en) | 1969-12-18 | 1969-12-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP44101321A JPS4939934B1 (en) | 1969-12-18 | 1969-12-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS4939934B1 true JPS4939934B1 (en) | 1974-10-30 |
Family
ID=14297531
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP44101321A Pending JPS4939934B1 (en) | 1969-12-18 | 1969-12-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS4939934B1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3521279A1 (en) | 2014-03-20 | 2019-08-07 | Fujifilm Corporation | Methods for protecting and deprotecting a diol group |
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1969
- 1969-12-18 JP JP44101321A patent/JPS4939934B1/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3521279A1 (en) | 2014-03-20 | 2019-08-07 | Fujifilm Corporation | Methods for protecting and deprotecting a diol group |
| EP3800185A1 (en) | 2014-03-20 | 2021-04-07 | FUJIFILM Corporation | Method for manufacturing salacinol |