JPS4939699B1 - - Google Patents
Info
- Publication number
- JPS4939699B1 JPS4939699B1 JP44031757A JP3175769A JPS4939699B1 JP S4939699 B1 JPS4939699 B1 JP S4939699B1 JP 44031757 A JP44031757 A JP 44031757A JP 3175769 A JP3175769 A JP 3175769A JP S4939699 B1 JPS4939699 B1 JP S4939699B1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Length-Measuring Devices Using Wave Or Particle Radiation (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP44031757A JPS4939699B1 (en) | 1969-04-24 | 1969-04-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP44031757A JPS4939699B1 (en) | 1969-04-24 | 1969-04-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS4939699B1 true JPS4939699B1 (en) | 1974-10-28 |
Family
ID=12339879
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP44031757A Pending JPS4939699B1 (en) | 1969-04-24 | 1969-04-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS4939699B1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012153462A1 (en) * | 2011-05-10 | 2012-11-15 | 信越半導体株式会社 | Method for determining film thickness of soi layer of soi wafer |
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1969
- 1969-04-24 JP JP44031757A patent/JPS4939699B1/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012153462A1 (en) * | 2011-05-10 | 2012-11-15 | 信越半導体株式会社 | Method for determining film thickness of soi layer of soi wafer |
| JP2012237602A (en) * | 2011-05-10 | 2012-12-06 | Shin Etsu Handotai Co Ltd | Method for measuring film thickness of soi layer of soi wafer |
| US8981291B2 (en) | 2011-05-10 | 2015-03-17 | Shin-Etsu Handotai Co., Ltd. | Method for measuring film thickness of SOI layer of SOI wafer |