JPS493851A - - Google Patents

Info

Publication number
JPS493851A
JPS493851A JP4350172A JP4350172A JPS493851A JP S493851 A JPS493851 A JP S493851A JP 4350172 A JP4350172 A JP 4350172A JP 4350172 A JP4350172 A JP 4350172A JP S493851 A JPS493851 A JP S493851A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4350172A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP4350172A priority Critical patent/JPS493851A/ja
Publication of JPS493851A publication Critical patent/JPS493851A/ja
Pending legal-status Critical Current

Links

Landscapes

  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
JP4350172A 1972-05-01 1972-05-01 Pending JPS493851A (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4350172A JPS493851A (fr) 1972-05-01 1972-05-01

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4350172A JPS493851A (fr) 1972-05-01 1972-05-01

Publications (1)

Publication Number Publication Date
JPS493851A true JPS493851A (fr) 1974-01-14

Family

ID=12665452

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4350172A Pending JPS493851A (fr) 1972-05-01 1972-05-01

Country Status (1)

Country Link
JP (1) JPS493851A (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7504719B2 (en) 1998-09-28 2009-03-17 Ibiden Co., Ltd. Printed wiring board having a roughened surface formed on a metal layer, and method for producing the same
GB2452174B (en) * 2006-05-03 2012-01-25 Omg Electronic Chemicals Inc A method and composition for selectively stripping nickel from a substrate

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7504719B2 (en) 1998-09-28 2009-03-17 Ibiden Co., Ltd. Printed wiring board having a roughened surface formed on a metal layer, and method for producing the same
US7535095B1 (en) 1998-09-28 2009-05-19 Ibiden Co., Ltd. Printed wiring board and method for producing the same
US7994433B2 (en) 1998-09-28 2011-08-09 Ibiden Co., Ltd. Printed wiring board and method for producing the same
US8006377B2 (en) 1998-09-28 2011-08-30 Ibiden Co., Ltd. Method for producing a printed wiring board
US8018045B2 (en) 1998-09-28 2011-09-13 Ibiden Co., Ltd. Printed circuit board
US8020291B2 (en) 1998-09-28 2011-09-20 Ibiden Co., Ltd. Method of manufacturing a printed wiring board
US8030577B2 (en) 1998-09-28 2011-10-04 Ibiden Co., Ltd. Printed wiring board and method for producing the same
US8093507B2 (en) 1998-09-28 2012-01-10 Ibiden Co., Ltd. Printed wiring board and method for producing the same
US8533943B2 (en) 1998-09-28 2013-09-17 Ibiden Co., Ltd. Printed wiring board and method for producing the same
GB2452174B (en) * 2006-05-03 2012-01-25 Omg Electronic Chemicals Inc A method and composition for selectively stripping nickel from a substrate

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