JPS493851A - - Google Patents
Info
- Publication number
- JPS493851A JPS493851A JP4350172A JP4350172A JPS493851A JP S493851 A JPS493851 A JP S493851A JP 4350172 A JP4350172 A JP 4350172A JP 4350172 A JP4350172 A JP 4350172A JP S493851 A JPS493851 A JP S493851A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Manufacturing Of Printed Circuit Boards (AREA)
- ing And Chemical Polishing (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4350172A JPS493851A (de) | 1972-05-01 | 1972-05-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4350172A JPS493851A (de) | 1972-05-01 | 1972-05-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS493851A true JPS493851A (de) | 1974-01-14 |
Family
ID=12665452
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4350172A Pending JPS493851A (de) | 1972-05-01 | 1972-05-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS493851A (de) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7504719B2 (en) | 1998-09-28 | 2009-03-17 | Ibiden Co., Ltd. | Printed wiring board having a roughened surface formed on a metal layer, and method for producing the same |
| GB2452174B (en) * | 2006-05-03 | 2012-01-25 | Omg Electronic Chemicals Inc | A method and composition for selectively stripping nickel from a substrate |
-
1972
- 1972-05-01 JP JP4350172A patent/JPS493851A/ja active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7504719B2 (en) | 1998-09-28 | 2009-03-17 | Ibiden Co., Ltd. | Printed wiring board having a roughened surface formed on a metal layer, and method for producing the same |
| US7535095B1 (en) | 1998-09-28 | 2009-05-19 | Ibiden Co., Ltd. | Printed wiring board and method for producing the same |
| US7994433B2 (en) | 1998-09-28 | 2011-08-09 | Ibiden Co., Ltd. | Printed wiring board and method for producing the same |
| US8006377B2 (en) | 1998-09-28 | 2011-08-30 | Ibiden Co., Ltd. | Method for producing a printed wiring board |
| US8018045B2 (en) | 1998-09-28 | 2011-09-13 | Ibiden Co., Ltd. | Printed circuit board |
| US8020291B2 (en) | 1998-09-28 | 2011-09-20 | Ibiden Co., Ltd. | Method of manufacturing a printed wiring board |
| US8030577B2 (en) | 1998-09-28 | 2011-10-04 | Ibiden Co., Ltd. | Printed wiring board and method for producing the same |
| US8093507B2 (en) | 1998-09-28 | 2012-01-10 | Ibiden Co., Ltd. | Printed wiring board and method for producing the same |
| US8533943B2 (en) | 1998-09-28 | 2013-09-17 | Ibiden Co., Ltd. | Printed wiring board and method for producing the same |
| GB2452174B (en) * | 2006-05-03 | 2012-01-25 | Omg Electronic Chemicals Inc | A method and composition for selectively stripping nickel from a substrate |