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Priority to JP47079346ApriorityCriticalpatent/JPS4937572A/ja
Publication of JPS4937572ApublicationCriticalpatent/JPS4937572A/ja
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
H01L24/02—Bonding areas ; Manufacturing methods related thereto
H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
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Engineering & Computer Science
(AREA)
Computer Hardware Design
(AREA)
Microelectronics & Electronic Packaging
(AREA)
Power Engineering
(AREA)
Electrodes Of Semiconductors
(AREA)
Testing Or Measuring Of Semiconductors Or The Like
(AREA)
Process for the preparation of large surface area, finely divided precipitated calcium carbonate and filled polymeric compositions of matter containing said calcium carbonate
Process for the preparation of large surface area, finely divided precipitated calcium carbonate and filled polymeric compositions of matter containing said calcium carbonate