JPS4936519B1 - - Google Patents

Info

Publication number
JPS4936519B1
JPS4936519B1 JP2753870A JP2753870A JPS4936519B1 JP S4936519 B1 JPS4936519 B1 JP S4936519B1 JP 2753870 A JP2753870 A JP 2753870A JP 2753870 A JP2753870 A JP 2753870A JP S4936519 B1 JPS4936519 B1 JP S4936519B1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2753870A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2753870A priority Critical patent/JPS4936519B1/ja
Publication of JPS4936519B1 publication Critical patent/JPS4936519B1/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/075Connecting or disconnecting of bond wires
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • H10W72/531Shapes of wire connectors
    • H10W72/536Shapes of wire connectors the connected ends being ball-shaped
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/90Bond pads, in general
    • H10W72/931Shapes of bond pads
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00Encapsulations, e.g. protective coatings

Landscapes

  • Wire Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
JP2753870A 1970-03-30 1970-03-30 Pending JPS4936519B1 (https=)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2753870A JPS4936519B1 (https=) 1970-03-30 1970-03-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2753870A JPS4936519B1 (https=) 1970-03-30 1970-03-30

Publications (1)

Publication Number Publication Date
JPS4936519B1 true JPS4936519B1 (https=) 1974-10-01

Family

ID=12223858

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2753870A Pending JPS4936519B1 (https=) 1970-03-30 1970-03-30

Country Status (1)

Country Link
JP (1) JPS4936519B1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5198827U (https=) * 1975-02-06 1976-08-07

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5198827U (https=) * 1975-02-06 1976-08-07

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