JPS4932999A - - Google Patents
Info
- Publication number
- JPS4932999A JPS4932999A JP47074764A JP7476472A JPS4932999A JP S4932999 A JPS4932999 A JP S4932999A JP 47074764 A JP47074764 A JP 47074764A JP 7476472 A JP7476472 A JP 7476472A JP S4932999 A JPS4932999 A JP S4932999A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7476472A JPS5649930B2 (en) | 1972-07-25 | 1972-07-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7476472A JPS5649930B2 (en) | 1972-07-25 | 1972-07-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4932999A true JPS4932999A (en) | 1974-03-26 |
| JPS5649930B2 JPS5649930B2 (en) | 1981-11-26 |
Family
ID=13556660
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7476472A Expired JPS5649930B2 (en) | 1972-07-25 | 1972-07-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5649930B2 (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5920370A (en) * | 1982-07-27 | 1984-02-02 | Toyo Ink Mfg Co Ltd | Conductive adhesive |
| JPS63248824A (en) * | 1987-04-03 | 1988-10-17 | Shin Etsu Chem Co Ltd | Epoxy resin composition |
| JPH01316365A (en) * | 1988-03-24 | 1989-12-21 | Shikoku Chem Corp | 1-benzylimidazole compound, synthesis thereof and curing of polyepoxy resin using said compound |
| WO2010103809A1 (en) * | 2009-03-11 | 2010-09-16 | 日本曹達株式会社 | Epoxy resin composition, curing agent, and curing accelerator |
| WO2010106780A1 (en) | 2009-03-17 | 2010-09-23 | 日本曹達株式会社 | Inclusion complex, curing agent, cure accelerator, epoxy resin composition, and epoxy resin composition for encapsulation of semiconductor |
| WO2012035755A1 (en) * | 2010-09-15 | 2012-03-22 | 日本曹達株式会社 | Liquid curable epoxy resin composition and adhesive agent containing same |
| JP2013213168A (en) * | 2012-04-04 | 2013-10-17 | Nippon Soda Co Ltd | Epoxy resin composition for prepreg |
| US8653160B2 (en) | 2007-09-21 | 2014-02-18 | Nippon Soda Co., Ltd. | Inclusion complex containing epoxy resin composition for semiconductor encapsulation |
| US8735529B2 (en) | 2006-12-21 | 2014-05-27 | Nippon Soda Co., Ltd. | Clathrate compound, curing catalyst, composition for forming cured resin, and cured resin |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS497599A (en) * | 1972-05-29 | 1974-01-23 |
-
1972
- 1972-07-25 JP JP7476472A patent/JPS5649930B2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS497599A (en) * | 1972-05-29 | 1974-01-23 |
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0242120B2 (en) * | 1982-07-27 | 1990-09-20 | ||
| JPS5920370A (en) * | 1982-07-27 | 1984-02-02 | Toyo Ink Mfg Co Ltd | Conductive adhesive |
| JPS63248824A (en) * | 1987-04-03 | 1988-10-17 | Shin Etsu Chem Co Ltd | Epoxy resin composition |
| JPH01316365A (en) * | 1988-03-24 | 1989-12-21 | Shikoku Chem Corp | 1-benzylimidazole compound, synthesis thereof and curing of polyepoxy resin using said compound |
| US8735529B2 (en) | 2006-12-21 | 2014-05-27 | Nippon Soda Co., Ltd. | Clathrate compound, curing catalyst, composition for forming cured resin, and cured resin |
| US8653160B2 (en) | 2007-09-21 | 2014-02-18 | Nippon Soda Co., Ltd. | Inclusion complex containing epoxy resin composition for semiconductor encapsulation |
| US8623942B2 (en) | 2009-03-11 | 2014-01-07 | Nippon Soda Co., Ltd. | Epoxy resin composition, curing agent, and curing accelerator |
| WO2010103809A1 (en) * | 2009-03-11 | 2010-09-16 | 日本曹達株式会社 | Epoxy resin composition, curing agent, and curing accelerator |
| KR101349996B1 (en) * | 2009-03-17 | 2014-01-13 | 닛뽕소다 가부시키가이샤 | Inclusion complex, curing agent, cure accelerator, epoxy resin composition, and epoxy resin composition for encapsulation of semiconductor |
| JP5459873B2 (en) * | 2009-03-17 | 2014-04-02 | 日本曹達株式会社 | Inclusion complex, curing agent, curing accelerator, epoxy resin composition, and epoxy resin composition for semiconductor encapsulation |
| WO2010106780A1 (en) | 2009-03-17 | 2010-09-23 | 日本曹達株式会社 | Inclusion complex, curing agent, cure accelerator, epoxy resin composition, and epoxy resin composition for encapsulation of semiconductor |
| CN103936676A (en) * | 2009-03-17 | 2014-07-23 | 日本曹达株式会社 | Inclusion complex, curing agent, cure accelerator, epoxy resin composition, and epoxy resin composition for encapsulation of semiconductor |
| US9023956B2 (en) | 2009-03-17 | 2015-05-05 | Nippon Soda Co., Ltd. | Clathrate, curing agent, cure accelerator, epoxy resin composition, and epoxy resin composition for encapsulation of semiconductor |
| WO2012035755A1 (en) * | 2010-09-15 | 2012-03-22 | 日本曹達株式会社 | Liquid curable epoxy resin composition and adhesive agent containing same |
| JP2013213168A (en) * | 2012-04-04 | 2013-10-17 | Nippon Soda Co Ltd | Epoxy resin composition for prepreg |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5649930B2 (en) | 1981-11-26 |