JPS4931292A - - Google Patents
Info
- Publication number
- JPS4931292A JPS4931292A JP7251872A JP7251872A JPS4931292A JP S4931292 A JPS4931292 A JP S4931292A JP 7251872 A JP7251872 A JP 7251872A JP 7251872 A JP7251872 A JP 7251872A JP S4931292 A JPS4931292 A JP S4931292A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
Landscapes
- Led Device Packages (AREA)
- Led Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7251872A JPS4931292A (US06277897-20010821-C00025.png) | 1972-07-21 | 1972-07-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7251872A JPS4931292A (US06277897-20010821-C00025.png) | 1972-07-21 | 1972-07-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS4931292A true JPS4931292A (US06277897-20010821-C00025.png) | 1974-03-20 |
Family
ID=13491617
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7251872A Pending JPS4931292A (US06277897-20010821-C00025.png) | 1972-07-21 | 1972-07-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS4931292A (US06277897-20010821-C00025.png) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60237473A (ja) * | 1984-05-11 | 1985-11-26 | Canon Inc | 照明装置 |
| JPS62199707U (US06277897-20010821-C00025.png) * | 1986-06-06 | 1987-12-19 | ||
| JP2005191138A (ja) * | 2003-12-24 | 2005-07-14 | Kyocera Corp | 発光装置 |
-
1972
- 1972-07-21 JP JP7251872A patent/JPS4931292A/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60237473A (ja) * | 1984-05-11 | 1985-11-26 | Canon Inc | 照明装置 |
| JPS62199707U (US06277897-20010821-C00025.png) * | 1986-06-06 | 1987-12-19 | ||
| JPH0532804Y2 (US06277897-20010821-C00025.png) * | 1986-06-06 | 1993-08-23 | ||
| JP2005191138A (ja) * | 2003-12-24 | 2005-07-14 | Kyocera Corp | 発光装置 |
