JPS492790B1 - - Google Patents
Info
- Publication number
- JPS492790B1 JPS492790B1 JP44035453A JP3545369A JPS492790B1 JP S492790 B1 JPS492790 B1 JP S492790B1 JP 44035453 A JP44035453 A JP 44035453A JP 3545369 A JP3545369 A JP 3545369A JP S492790 B1 JPS492790 B1 JP S492790B1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP44035453A JPS492790B1 (no) | 1969-05-07 | 1969-05-07 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP44035453A JPS492790B1 (no) | 1969-05-07 | 1969-05-07 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS492790B1 true JPS492790B1 (no) | 1974-01-22 |
Family
ID=12442210
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP44035453A Pending JPS492790B1 (no) | 1969-05-07 | 1969-05-07 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS492790B1 (no) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59108761U (ja) * | 1983-01-10 | 1984-07-21 | 小沢 正樹 | テ−プカツタ− |
JPS6053755U (ja) * | 1983-09-20 | 1985-04-16 | 前田 光 | 折返し付粘着テ−プカッタ− |
JPS6447738U (no) * | 1987-09-18 | 1989-03-24 |
-
1969
- 1969-05-07 JP JP44035453A patent/JPS492790B1/ja active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59108761U (ja) * | 1983-01-10 | 1984-07-21 | 小沢 正樹 | テ−プカツタ− |
JPS6053755U (ja) * | 1983-09-20 | 1985-04-16 | 前田 光 | 折返し付粘着テ−プカッタ− |
JPS6447738U (no) * | 1987-09-18 | 1989-03-24 |