JPS4927646U - - Google Patents

Info

Publication number
JPS4927646U
JPS4927646U JP7054572U JP7054572U JPS4927646U JP S4927646 U JPS4927646 U JP S4927646U JP 7054572 U JP7054572 U JP 7054572U JP 7054572 U JP7054572 U JP 7054572U JP S4927646 U JPS4927646 U JP S4927646U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7054572U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP7054572U priority Critical patent/JPS4927646U/ja
Publication of JPS4927646U publication Critical patent/JPS4927646U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Die Bonding (AREA)
JP7054572U 1972-06-14 1972-06-14 Pending JPS4927646U (un)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7054572U JPS4927646U (un) 1972-06-14 1972-06-14

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7054572U JPS4927646U (un) 1972-06-14 1972-06-14

Publications (1)

Publication Number Publication Date
JPS4927646U true JPS4927646U (un) 1974-03-09

Family

ID=27967899

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7054572U Pending JPS4927646U (un) 1972-06-14 1972-06-14

Country Status (1)

Country Link
JP (1) JPS4927646U (un)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5691747A (en) * 1979-12-26 1981-07-24 Tokyo Electric Co Ltd Automatic electric moxa cautery device
JPS62173171U (un) * 1985-12-19 1987-11-04
JPH01141539U (un) * 1988-03-15 1989-09-28

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3607379A (en) * 1968-01-22 1971-09-21 Us Navy Microelectronic interconnection substrate

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3607379A (en) * 1968-01-22 1971-09-21 Us Navy Microelectronic interconnection substrate

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5691747A (en) * 1979-12-26 1981-07-24 Tokyo Electric Co Ltd Automatic electric moxa cautery device
JPS62173171U (un) * 1985-12-19 1987-11-04
JPH01141539U (un) * 1988-03-15 1989-09-28
JPH0449957Y2 (un) * 1988-03-15 1992-11-25

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