JPS4926472B1 - - Google Patents

Info

Publication number
JPS4926472B1
JPS4926472B1 JP45029792A JP2979270A JPS4926472B1 JP S4926472 B1 JPS4926472 B1 JP S4926472B1 JP 45029792 A JP45029792 A JP 45029792A JP 2979270 A JP2979270 A JP 2979270A JP S4926472 B1 JPS4926472 B1 JP S4926472B1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP45029792A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP45029792A priority Critical patent/JPS4926472B1/ja
Publication of JPS4926472B1 publication Critical patent/JPS4926472B1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)
JP45029792A 1970-04-09 1970-04-09 Pending JPS4926472B1 (env)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP45029792A JPS4926472B1 (env) 1970-04-09 1970-04-09

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP45029792A JPS4926472B1 (env) 1970-04-09 1970-04-09

Publications (1)

Publication Number Publication Date
JPS4926472B1 true JPS4926472B1 (env) 1974-07-09

Family

ID=12285832

Family Applications (1)

Application Number Title Priority Date Filing Date
JP45029792A Pending JPS4926472B1 (env) 1970-04-09 1970-04-09

Country Status (1)

Country Link
JP (1) JPS4926472B1 (env)

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