JPS4925822A - - Google Patents
Info
- Publication number
- JPS4925822A JPS4925822A JP4546572A JP4546572A JPS4925822A JP S4925822 A JPS4925822 A JP S4925822A JP 4546572 A JP4546572 A JP 4546572A JP 4546572 A JP4546572 A JP 4546572A JP S4925822 A JPS4925822 A JP S4925822A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Ink Jet (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
- Facsimile Heads (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4546572A JPS4925822A (cs) | 1972-05-10 | 1972-05-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4546572A JPS4925822A (cs) | 1972-05-10 | 1972-05-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS4925822A true JPS4925822A (cs) | 1974-03-07 |
Family
ID=12720106
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4546572A Pending JPS4925822A (cs) | 1972-05-10 | 1972-05-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS4925822A (cs) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5114983B1 (cs) * | 1970-02-16 | 1976-05-13 | ||
| JPS58166497U (ja) * | 1982-04-26 | 1983-11-05 | 横河電機株式会社 | 多色ｘｙプロツタ |
| JPS5919397U (ja) * | 1982-07-30 | 1984-02-06 | 横河電機株式会社 | 記録ペン機構 |
| US4597520A (en) * | 1984-09-06 | 1986-07-01 | Biggs Kenneth L | Bonding method and means |
| US5058798A (en) * | 1989-04-17 | 1991-10-22 | Kabushiki Kaisha Shinkawa | Method for forming bump on semiconductor elements |
-
1972
- 1972-05-10 JP JP4546572A patent/JPS4925822A/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5114983B1 (cs) * | 1970-02-16 | 1976-05-13 | ||
| JPS58166497U (ja) * | 1982-04-26 | 1983-11-05 | 横河電機株式会社 | 多色ｘｙプロツタ |
| JPS5919397U (ja) * | 1982-07-30 | 1984-02-06 | 横河電機株式会社 | 記録ペン機構 |
| US4597520A (en) * | 1984-09-06 | 1986-07-01 | Biggs Kenneth L | Bonding method and means |
| US5058798A (en) * | 1989-04-17 | 1991-10-22 | Kabushiki Kaisha Shinkawa | Method for forming bump on semiconductor elements |