JPS4925499A - - Google Patents
Info
- Publication number
- JPS4925499A JPS4925499A JP6593472A JP6593472A JPS4925499A JP S4925499 A JPS4925499 A JP S4925499A JP 6593472 A JP6593472 A JP 6593472A JP 6593472 A JP6593472 A JP 6593472A JP S4925499 A JPS4925499 A JP S4925499A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Laminated Bodies (AREA)
- Inorganic Insulating Materials (AREA)
- Organic Insulating Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6593472A JPS5543202B2 (ja) | 1972-07-01 | 1972-07-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6593472A JPS5543202B2 (ja) | 1972-07-01 | 1972-07-01 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4925499A true JPS4925499A (ja) | 1974-03-06 |
| JPS5543202B2 JPS5543202B2 (ja) | 1980-11-05 |
Family
ID=13301271
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6593472A Expired JPS5543202B2 (ja) | 1972-07-01 | 1972-07-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5543202B2 (ja) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5743491A (en) * | 1980-08-29 | 1982-03-11 | Toray Industries | Printed circuit board |
| JPS57135153A (en) * | 1981-02-14 | 1982-08-20 | Matsushita Electric Works Ltd | Method of bonding copper foil to shape |
| US7947332B2 (en) | 2004-06-23 | 2011-05-24 | Hitachi Chemical Company, Ltd. | Prepreg for printed wiring board, metal foil clad laminate and printed wiring board, and, method for manufacturing multi-layer printed wiring board |
| JP2017224758A (ja) * | 2016-06-16 | 2017-12-21 | 日本化薬株式会社 | 高周波回路に適した両面回路用基板 |
| US10785868B2 (en) | 2016-10-05 | 2020-09-22 | Panasonic Intellectual Property Management Co., Ltd. | Multilayer printed wiring board and method for producing multilayer printed wiring board |
-
1972
- 1972-07-01 JP JP6593472A patent/JPS5543202B2/ja not_active Expired
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5743491A (en) * | 1980-08-29 | 1982-03-11 | Toray Industries | Printed circuit board |
| JPS57135153A (en) * | 1981-02-14 | 1982-08-20 | Matsushita Electric Works Ltd | Method of bonding copper foil to shape |
| US7947332B2 (en) | 2004-06-23 | 2011-05-24 | Hitachi Chemical Company, Ltd. | Prepreg for printed wiring board, metal foil clad laminate and printed wiring board, and, method for manufacturing multi-layer printed wiring board |
| JP2017224758A (ja) * | 2016-06-16 | 2017-12-21 | 日本化薬株式会社 | 高周波回路に適した両面回路用基板 |
| US10785868B2 (en) | 2016-10-05 | 2020-09-22 | Panasonic Intellectual Property Management Co., Ltd. | Multilayer printed wiring board and method for producing multilayer printed wiring board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5543202B2 (ja) | 1980-11-05 |