JPS492324B1 - - Google Patents
Info
- Publication number
- JPS492324B1 JPS492324B1 JP12158170A JP12158170A JPS492324B1 JP S492324 B1 JPS492324 B1 JP S492324B1 JP 12158170 A JP12158170 A JP 12158170A JP 12158170 A JP12158170 A JP 12158170A JP S492324 B1 JPS492324 B1 JP S492324B1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12158170A JPS492324B1 (en) | 1970-12-29 | 1970-12-29 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12158170A JPS492324B1 (en) | 1970-12-29 | 1970-12-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS492324B1 true JPS492324B1 (en) | 1974-01-19 |
Family
ID=14814771
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12158170A Pending JPS492324B1 (en) | 1970-12-29 | 1970-12-29 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS492324B1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001316502A (en) * | 2000-04-28 | 2001-11-16 | Jsr Corp | Heat transfer sheet, heating structure, heat radiation structure, electric examination method and apparatus using the same |
WO2009144925A1 (en) * | 2008-05-31 | 2009-12-03 | 株式会社スリーボンド | Conductive resin composition |
-
1970
- 1970-12-29 JP JP12158170A patent/JPS492324B1/ja active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001316502A (en) * | 2000-04-28 | 2001-11-16 | Jsr Corp | Heat transfer sheet, heating structure, heat radiation structure, electric examination method and apparatus using the same |
WO2009144925A1 (en) * | 2008-05-31 | 2009-12-03 | 株式会社スリーボンド | Conductive resin composition |
JP2009286977A (en) * | 2008-05-31 | 2009-12-10 | Three Bond Co Ltd | Electroconductive resin composition |