JPS4923137A - - Google Patents
Info
- Publication number
- JPS4923137A JPS4923137A JP6437572A JP6437572A JPS4923137A JP S4923137 A JPS4923137 A JP S4923137A JP 6437572 A JP6437572 A JP 6437572A JP 6437572 A JP6437572 A JP 6437572A JP S4923137 A JPS4923137 A JP S4923137A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Electroplating And Plating Baths Therefor (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6437572A JPS5335898B2 (cg-RX-API-DMAC10.html) | 1972-06-26 | 1972-06-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6437572A JPS5335898B2 (cg-RX-API-DMAC10.html) | 1972-06-26 | 1972-06-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4923137A true JPS4923137A (cg-RX-API-DMAC10.html) | 1974-03-01 |
| JPS5335898B2 JPS5335898B2 (cg-RX-API-DMAC10.html) | 1978-09-29 |
Family
ID=13256473
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6437572A Expired JPS5335898B2 (cg-RX-API-DMAC10.html) | 1972-06-26 | 1972-06-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5335898B2 (cg-RX-API-DMAC10.html) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5887900A (ja) * | 1981-11-20 | 1983-05-25 | 株式会社村田製作所 | 電子部品連の製造方法 |
| GB2325673A (en) * | 1997-05-30 | 1998-12-02 | Fukuda Metal Foil Powder | Copper foil formed from electrolyte containing nitrogen-containing organic compound |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2890983B1 (fr) * | 2005-09-20 | 2007-12-14 | Alchimer Sa | Composition d'electrodeposition destinee au revetement d'une surface d'un substrat par un metal. |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5116893A (ja) * | 1974-08-01 | 1976-02-10 | Casio Computer Co Ltd | Ekishohyojiseigyosochi |
-
1972
- 1972-06-26 JP JP6437572A patent/JPS5335898B2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5116893A (ja) * | 1974-08-01 | 1976-02-10 | Casio Computer Co Ltd | Ekishohyojiseigyosochi |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5887900A (ja) * | 1981-11-20 | 1983-05-25 | 株式会社村田製作所 | 電子部品連の製造方法 |
| GB2325673A (en) * | 1997-05-30 | 1998-12-02 | Fukuda Metal Foil Powder | Copper foil formed from electrolyte containing nitrogen-containing organic compound |
| US6231742B1 (en) | 1997-05-30 | 2001-05-15 | Fukuda Metal Foil & Powder Co., Ltd. | Electrolytic Copper foil and process for producing the same |
| GB2325673B (en) * | 1997-05-30 | 2002-04-10 | Fukuda Metal Foil Powder | Electrolytic copper foil and process for producing it |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5335898B2 (cg-RX-API-DMAC10.html) | 1978-09-29 |