JPS4922857U - - Google Patents

Info

Publication number
JPS4922857U
JPS4922857U JP1972063675U JP6367572U JPS4922857U JP S4922857 U JPS4922857 U JP S4922857U JP 1972063675 U JP1972063675 U JP 1972063675U JP 6367572 U JP6367572 U JP 6367572U JP S4922857 U JPS4922857 U JP S4922857U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1972063675U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1972063675U priority Critical patent/JPS4922857U/ja
Publication of JPS4922857U publication Critical patent/JPS4922857U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/30Die-attach connectors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/851Dispositions of multiple connectors or interconnections
    • H10W72/874On different surfaces
    • H10W72/884Die-attach connectors and bond wires
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
JP1972063675U 1972-05-30 1972-05-30 Pending JPS4922857U (https=)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1972063675U JPS4922857U (https=) 1972-05-30 1972-05-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1972063675U JPS4922857U (https=) 1972-05-30 1972-05-30

Publications (1)

Publication Number Publication Date
JPS4922857U true JPS4922857U (https=) 1974-02-26

Family

ID=27955009

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1972063675U Pending JPS4922857U (https=) 1972-05-30 1972-05-30

Country Status (1)

Country Link
JP (1) JPS4922857U (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5286092A (en) * 1976-01-12 1977-07-16 Hitachi Ltd Semiconductor integrated circuit

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5286092A (en) * 1976-01-12 1977-07-16 Hitachi Ltd Semiconductor integrated circuit

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