JPS4918619Y1 - - Google Patents
Info
- Publication number
- JPS4918619Y1 JPS4918619Y1 JP10355170U JP10355170U JPS4918619Y1 JP S4918619 Y1 JPS4918619 Y1 JP S4918619Y1 JP 10355170 U JP10355170 U JP 10355170U JP 10355170 U JP10355170 U JP 10355170U JP S4918619 Y1 JPS4918619 Y1 JP S4918619Y1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10355170U JPS4918619Y1 (en) | 1970-10-20 | 1970-10-20 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10355170U JPS4918619Y1 (en) | 1970-10-20 | 1970-10-20 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS4918619Y1 true JPS4918619Y1 (en) | 1974-05-17 |
Family
ID=33265103
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10355170U Expired JPS4918619Y1 (en) | 1970-10-20 | 1970-10-20 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS4918619Y1 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015137029A1 (en) * | 2014-03-14 | 2015-09-17 | 株式会社新川 | Bonding apparatus and bonding method |
JP2015177043A (en) * | 2014-03-14 | 2015-10-05 | 株式会社新川 | Bonding device and bonding method |
JP5849163B1 (en) * | 2015-01-19 | 2016-01-27 | 株式会社新川 | Bonding apparatus and bonding method |
-
1970
- 1970-10-20 JP JP10355170U patent/JPS4918619Y1/ja not_active Expired
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015137029A1 (en) * | 2014-03-14 | 2015-09-17 | 株式会社新川 | Bonding apparatus and bonding method |
JP2015177043A (en) * | 2014-03-14 | 2015-10-05 | 株式会社新川 | Bonding device and bonding method |
JP5849163B1 (en) * | 2015-01-19 | 2016-01-27 | 株式会社新川 | Bonding apparatus and bonding method |