JPS49125842U - - Google Patents

Info

Publication number
JPS49125842U
JPS49125842U JP1973022751U JP2275173U JPS49125842U JP S49125842 U JPS49125842 U JP S49125842U JP 1973022751 U JP1973022751 U JP 1973022751U JP 2275173 U JP2275173 U JP 2275173U JP S49125842 U JPS49125842 U JP S49125842U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1973022751U
Other languages
Japanese (ja)
Other versions
JPS5623887Y2 (enrdf_load_html_response
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1973022751U priority Critical patent/JPS5623887Y2/ja
Publication of JPS49125842U publication Critical patent/JPS49125842U/ja
Application granted granted Critical
Publication of JPS5623887Y2 publication Critical patent/JPS5623887Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
    • H01L2224/241—Disposition
    • H01L2224/24151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/24153—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being arranged next to each other, e.g. on a common substrate
    • H01L2224/24175—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being arranged next to each other, e.g. on a common substrate the item being metallic

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP1973022751U 1973-02-23 1973-02-23 Expired JPS5623887Y2 (enrdf_load_html_response)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1973022751U JPS5623887Y2 (enrdf_load_html_response) 1973-02-23 1973-02-23

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1973022751U JPS5623887Y2 (enrdf_load_html_response) 1973-02-23 1973-02-23

Publications (2)

Publication Number Publication Date
JPS49125842U true JPS49125842U (enrdf_load_html_response) 1974-10-28
JPS5623887Y2 JPS5623887Y2 (enrdf_load_html_response) 1981-06-04

Family

ID=28116523

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1973022751U Expired JPS5623887Y2 (enrdf_load_html_response) 1973-02-23 1973-02-23

Country Status (1)

Country Link
JP (1) JPS5623887Y2 (enrdf_load_html_response)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4728441U (enrdf_load_html_response) * 1971-04-14 1972-12-01

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4728441U (enrdf_load_html_response) * 1971-04-14 1972-12-01

Also Published As

Publication number Publication date
JPS5623887Y2 (enrdf_load_html_response) 1981-06-04

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