JPS49114363A - - Google Patents

Info

Publication number
JPS49114363A
JPS49114363A JP2321473A JP2321473A JPS49114363A JP S49114363 A JPS49114363 A JP S49114363A JP 2321473 A JP2321473 A JP 2321473A JP 2321473 A JP2321473 A JP 2321473A JP S49114363 A JPS49114363 A JP S49114363A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2321473A
Other languages
Japanese (ja)
Other versions
JPS5537856B2 (enrdf_load_html_response
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2321473A priority Critical patent/JPS5537856B2/ja
Publication of JPS49114363A publication Critical patent/JPS49114363A/ja
Publication of JPS5537856B2 publication Critical patent/JPS5537856B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2321473A 1973-02-28 1973-02-28 Expired JPS5537856B2 (enrdf_load_html_response)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2321473A JPS5537856B2 (enrdf_load_html_response) 1973-02-28 1973-02-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2321473A JPS5537856B2 (enrdf_load_html_response) 1973-02-28 1973-02-28

Publications (2)

Publication Number Publication Date
JPS49114363A true JPS49114363A (enrdf_load_html_response) 1974-10-31
JPS5537856B2 JPS5537856B2 (enrdf_load_html_response) 1980-09-30

Family

ID=12104399

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2321473A Expired JPS5537856B2 (enrdf_load_html_response) 1973-02-28 1973-02-28

Country Status (1)

Country Link
JP (1) JPS5537856B2 (enrdf_load_html_response)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5627941A (en) * 1979-08-17 1981-03-18 Hitachi Ltd Manufacture of semiconductor device
JPH027549A (ja) * 1988-02-24 1990-01-11 Motorola Inc 接着増進剤を有するプラスチック封止用半導体ダイ

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS587412U (ja) * 1981-07-07 1983-01-18 マスプロ電工株式会社 同軸ケ−ブル
JPS5875755U (ja) * 1981-11-16 1983-05-21 丸昌工業株式会社 自動浸漬装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5025734U (enrdf_load_html_response) * 1973-07-09 1975-03-25

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5025734U (enrdf_load_html_response) * 1973-07-09 1975-03-25

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5627941A (en) * 1979-08-17 1981-03-18 Hitachi Ltd Manufacture of semiconductor device
JPH027549A (ja) * 1988-02-24 1990-01-11 Motorola Inc 接着増進剤を有するプラスチック封止用半導体ダイ

Also Published As

Publication number Publication date
JPS5537856B2 (enrdf_load_html_response) 1980-09-30

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