JPS49111583A - - Google Patents
Info
- Publication number
- JPS49111583A JPS49111583A JP2186473A JP2186473A JPS49111583A JP S49111583 A JPS49111583 A JP S49111583A JP 2186473 A JP2186473 A JP 2186473A JP 2186473 A JP2186473 A JP 2186473A JP S49111583 A JPS49111583 A JP S49111583A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W44/00—Electrical arrangements for controlling or matching impedance
- H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
- H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2186473A JPS5758783B2 (https=) | 1973-02-22 | 1973-02-22 | |
| US44434774 US3893193A (en) | 1973-02-22 | 1974-02-21 | Hermetically housed electrical component device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2186473A JPS5758783B2 (https=) | 1973-02-22 | 1973-02-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS49111583A true JPS49111583A (https=) | 1974-10-24 |
| JPS5758783B2 JPS5758783B2 (https=) | 1982-12-11 |
Family
ID=12066973
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2186473A Expired JPS5758783B2 (https=) | 1973-02-22 | 1973-02-22 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US3893193A (https=) |
| JP (1) | JPS5758783B2 (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57162451A (en) * | 1981-03-31 | 1982-10-06 | Fujitsu Ltd | Semiconductor device |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4282597A (en) * | 1977-11-28 | 1981-08-04 | Texas Instruments Incorporated | Metal-coated plastic housing for electronic components and the method of making same |
| US4571277A (en) * | 1982-03-24 | 1986-02-18 | An-Rix, Inc. | Cold recapping method for tires utilizing uncured rubber and compressible mold |
| US4689583A (en) * | 1984-02-13 | 1987-08-25 | Raytheon Company | Dual diode module with heat sink, for use in a cavity power combiner |
| EP0162521A3 (en) * | 1984-05-23 | 1986-10-08 | American Microsystems, Incorporated | Package for semiconductor devices |
| CA1264380C (en) * | 1985-01-30 | 1990-01-09 | SEMICONDUCTOR DEVICE BOX WITH INTEGRATED GROUNDING CONDUCTOR AND SIDEWALL | |
| US4722137A (en) * | 1986-02-05 | 1988-02-02 | Hewlett-Packard Company | High frequency hermetically sealed package for solid-state components |
| RU2128479C1 (ru) * | 1988-03-23 | 1999-04-10 | Хилл-Ром, Инк. | Устройство для поддержания пациента (варианты) и способ поддержания тела человека на матраце |
| DE502005009909D1 (de) * | 2005-09-24 | 2010-08-26 | Grundfos Management As | Spaltrohr |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE202925C (https=) * | 1969-04-30 | 1900-01-01 | ||
| US3502786A (en) * | 1967-06-14 | 1970-03-24 | Milton Stoll | Flat pack spacer of low thermal diffusivity |
| US3801938A (en) * | 1972-05-31 | 1974-04-02 | Trw Inc | Package for microwave semiconductor device |
-
1973
- 1973-02-22 JP JP2186473A patent/JPS5758783B2/ja not_active Expired
-
1974
- 1974-02-21 US US44434774 patent/US3893193A/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57162451A (en) * | 1981-03-31 | 1982-10-06 | Fujitsu Ltd | Semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| US3893193A (en) | 1975-07-01 |
| JPS5758783B2 (https=) | 1982-12-11 |