JPS4911031U - - Google Patents

Info

Publication number
JPS4911031U
JPS4911031U JP5272672U JP5272672U JPS4911031U JP S4911031 U JPS4911031 U JP S4911031U JP 5272672 U JP5272672 U JP 5272672U JP 5272672 U JP5272672 U JP 5272672U JP S4911031 U JPS4911031 U JP S4911031U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5272672U
Other languages
Japanese (ja)
Other versions
JPS5310430Y2 (hu
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP5272672U priority Critical patent/JPS5310430Y2/ja
Publication of JPS4911031U publication Critical patent/JPS4911031U/ja
Application granted granted Critical
Publication of JPS5310430Y2 publication Critical patent/JPS5310430Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743Apparatus for manufacturing layer connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP5272672U 1972-05-08 1972-05-08 Expired JPS5310430Y2 (hu)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5272672U JPS5310430Y2 (hu) 1972-05-08 1972-05-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5272672U JPS5310430Y2 (hu) 1972-05-08 1972-05-08

Publications (2)

Publication Number Publication Date
JPS4911031U true JPS4911031U (hu) 1974-01-30
JPS5310430Y2 JPS5310430Y2 (hu) 1978-03-20

Family

ID=27934570

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5272672U Expired JPS5310430Y2 (hu) 1972-05-08 1972-05-08

Country Status (1)

Country Link
JP (1) JPS5310430Y2 (hu)

Also Published As

Publication number Publication date
JPS5310430Y2 (hu) 1978-03-20

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