JPS49107954U - - Google Patents
Info
- Publication number
- JPS49107954U JPS49107954U JP12773U JP12773U JPS49107954U JP S49107954 U JPS49107954 U JP S49107954U JP 12773 U JP12773 U JP 12773U JP 12773 U JP12773 U JP 12773U JP S49107954 U JPS49107954 U JP S49107954U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/4901—Structure
- H01L2224/4903—Connectors having different sizes, e.g. different diameters
Landscapes
- Amplifiers (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12773U JPS49107954U (sv) | 1972-12-31 | 1972-12-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12773U JPS49107954U (sv) | 1972-12-31 | 1972-12-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS49107954U true JPS49107954U (sv) | 1974-09-14 |
Family
ID=39146453
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12773U Pending JPS49107954U (sv) | 1972-12-31 | 1972-12-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS49107954U (sv) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3027502A (en) * | 1960-07-08 | 1962-03-27 | Nippon Electric Co | Semiconductor device |
-
1972
- 1972-12-31 JP JP12773U patent/JPS49107954U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3027502A (en) * | 1960-07-08 | 1962-03-27 | Nippon Electric Co | Semiconductor device |