JPS49107079A - - Google Patents
Info
- Publication number
- JPS49107079A JPS49107079A JP1763773A JP1763773A JPS49107079A JP S49107079 A JPS49107079 A JP S49107079A JP 1763773 A JP1763773 A JP 1763773A JP 1763773 A JP1763773 A JP 1763773A JP S49107079 A JPS49107079 A JP S49107079A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Laminated Bodies (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1763773A JPS5222393B2 (enrdf_load_stackoverflow) | 1973-02-13 | 1973-02-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1763773A JPS5222393B2 (enrdf_load_stackoverflow) | 1973-02-13 | 1973-02-13 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS49107079A true JPS49107079A (enrdf_load_stackoverflow) | 1974-10-11 |
| JPS5222393B2 JPS5222393B2 (enrdf_load_stackoverflow) | 1977-06-17 |
Family
ID=11949367
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1763773A Expired JPS5222393B2 (enrdf_load_stackoverflow) | 1973-02-13 | 1973-02-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5222393B2 (enrdf_load_stackoverflow) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6019431U (ja) * | 1983-07-19 | 1985-02-09 | 松下電器産業株式会社 | ガラス布基材エポキシ樹脂積層板 |
| EP0844074A3 (de) * | 1996-11-25 | 1999-08-25 | ISOVOLTAÖsterreichische IsolierstoffwerkeAktiengesellschaft | Metallfolienlaminat, ein Verfahren zu dessen Herstellung sowie dessen Verwendung als Dach- oder Fassadenplatte |
| WO2002034023A1 (en) * | 2000-10-16 | 2002-04-25 | Matsushita Electric Industrial Co., Ltd. | Circuit forming board producing method, circuit forming board, and material for circuit forming board |
-
1973
- 1973-02-13 JP JP1763773A patent/JPS5222393B2/ja not_active Expired
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6019431U (ja) * | 1983-07-19 | 1985-02-09 | 松下電器産業株式会社 | ガラス布基材エポキシ樹脂積層板 |
| EP0844074A3 (de) * | 1996-11-25 | 1999-08-25 | ISOVOLTAÖsterreichische IsolierstoffwerkeAktiengesellschaft | Metallfolienlaminat, ein Verfahren zu dessen Herstellung sowie dessen Verwendung als Dach- oder Fassadenplatte |
| WO2002034023A1 (en) * | 2000-10-16 | 2002-04-25 | Matsushita Electric Industrial Co., Ltd. | Circuit forming board producing method, circuit forming board, and material for circuit forming board |
| US6833042B2 (en) | 2000-10-16 | 2004-12-21 | Matsushita Electric Industrial Co., Ltd. | Method of manufacturing clad board for forming circuitry, clad board, and core board for clad board |
| US7754321B2 (en) | 2000-10-16 | 2010-07-13 | Panasonic Corporation | Method of manufacturing clad board for forming circuitry, clad board and core board for clad board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5222393B2 (enrdf_load_stackoverflow) | 1977-06-17 |