JPS49105489A - - Google Patents

Info

Publication number
JPS49105489A
JPS49105489A JP48014731A JP1473173A JPS49105489A JP S49105489 A JPS49105489 A JP S49105489A JP 48014731 A JP48014731 A JP 48014731A JP 1473173 A JP1473173 A JP 1473173A JP S49105489 A JPS49105489 A JP S49105489A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP48014731A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP48014731A priority Critical patent/JPS49105489A/ja
Publication of JPS49105489A publication Critical patent/JPS49105489A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05541—Structure
    • H01L2224/05548—Bonding area integrally formed with a redistribution layer on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05556—Shape in side view

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Bipolar Transistors (AREA)
JP48014731A 1973-02-07 1973-02-07 Pending JPS49105489A (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP48014731A JPS49105489A (enrdf_load_stackoverflow) 1973-02-07 1973-02-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP48014731A JPS49105489A (enrdf_load_stackoverflow) 1973-02-07 1973-02-07

Publications (1)

Publication Number Publication Date
JPS49105489A true JPS49105489A (enrdf_load_stackoverflow) 1974-10-05

Family

ID=11869260

Family Applications (1)

Application Number Title Priority Date Filing Date
JP48014731A Pending JPS49105489A (enrdf_load_stackoverflow) 1973-02-07 1973-02-07

Country Status (1)

Country Link
JP (1) JPS49105489A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5472466U (enrdf_load_stackoverflow) * 1977-10-31 1979-05-23
JPS5643175U (enrdf_load_stackoverflow) * 1979-09-12 1981-04-20
JPH03229457A (ja) * 1990-02-05 1991-10-11 Matsushita Electron Corp 半導体集積回路装置およびその製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4530332Y1 (enrdf_load_stackoverflow) * 1967-06-19 1970-11-20

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4530332Y1 (enrdf_load_stackoverflow) * 1967-06-19 1970-11-20

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5472466U (enrdf_load_stackoverflow) * 1977-10-31 1979-05-23
JPS5643175U (enrdf_load_stackoverflow) * 1979-09-12 1981-04-20
JPH03229457A (ja) * 1990-02-05 1991-10-11 Matsushita Electron Corp 半導体集積回路装置およびその製造方法

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