JPS49100966A - - Google Patents
Info
- Publication number
- JPS49100966A JPS49100966A JP48011842A JP1184273A JPS49100966A JP S49100966 A JPS49100966 A JP S49100966A JP 48011842 A JP48011842 A JP 48011842A JP 1184273 A JP1184273 A JP 1184273A JP S49100966 A JPS49100966 A JP S49100966A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L24/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
- H01L24/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
- H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP48011842A JPS49100966A (fr) | 1973-01-31 | 1973-01-31 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP48011842A JPS49100966A (fr) | 1973-01-31 | 1973-01-31 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS49100966A true JPS49100966A (fr) | 1974-09-24 |
Family
ID=11788968
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP48011842A Pending JPS49100966A (fr) | 1973-01-31 | 1973-01-31 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS49100966A (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6466949A (en) * | 1987-08-14 | 1989-03-13 | Siemens Ag | Electronics conductor plate |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4213216Y1 (fr) * | 1966-04-18 | 1967-07-27 |
-
1973
- 1973-01-31 JP JP48011842A patent/JPS49100966A/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4213216Y1 (fr) * | 1966-04-18 | 1967-07-27 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6466949A (en) * | 1987-08-14 | 1989-03-13 | Siemens Ag | Electronics conductor plate |