JPS4899062U - - Google Patents

Info

Publication number
JPS4899062U
JPS4899062U JP2438272U JP2438272U JPS4899062U JP S4899062 U JPS4899062 U JP S4899062U JP 2438272 U JP2438272 U JP 2438272U JP 2438272 U JP2438272 U JP 2438272U JP S4899062 U JPS4899062 U JP S4899062U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2438272U
Other languages
Japanese (ja)
Other versions
JPS5150452Y2 (de
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2438272U priority Critical patent/JPS5150452Y2/ja
Publication of JPS4899062U publication Critical patent/JPS4899062U/ja
Application granted granted Critical
Publication of JPS5150452Y2 publication Critical patent/JPS5150452Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Die Bonding (AREA)
JP2438272U 1972-02-28 1972-02-28 Expired JPS5150452Y2 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2438272U JPS5150452Y2 (de) 1972-02-28 1972-02-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2438272U JPS5150452Y2 (de) 1972-02-28 1972-02-28

Publications (2)

Publication Number Publication Date
JPS4899062U true JPS4899062U (de) 1973-11-22
JPS5150452Y2 JPS5150452Y2 (de) 1976-12-04

Family

ID=27881414

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2438272U Expired JPS5150452Y2 (de) 1972-02-28 1972-02-28

Country Status (1)

Country Link
JP (1) JPS5150452Y2 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS518074U (de) * 1974-07-02 1976-01-21

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS518074U (de) * 1974-07-02 1976-01-21

Also Published As

Publication number Publication date
JPS5150452Y2 (de) 1976-12-04

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