JPS4891981A - - Google Patents

Info

Publication number
JPS4891981A
JPS4891981A JP2431272A JP2431272A JPS4891981A JP S4891981 A JPS4891981 A JP S4891981A JP 2431272 A JP2431272 A JP 2431272A JP 2431272 A JP2431272 A JP 2431272A JP S4891981 A JPS4891981 A JP S4891981A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2431272A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2431272A priority Critical patent/JPS4891981A/ja
Publication of JPS4891981A publication Critical patent/JPS4891981A/ja
Pending legal-status Critical Current

Links

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2431272A 1972-03-08 1972-03-08 Pending JPS4891981A (da)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2431272A JPS4891981A (da) 1972-03-08 1972-03-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2431272A JPS4891981A (da) 1972-03-08 1972-03-08

Publications (1)

Publication Number Publication Date
JPS4891981A true JPS4891981A (da) 1973-11-29

Family

ID=12134646

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2431272A Pending JPS4891981A (da) 1972-03-08 1972-03-08

Country Status (1)

Country Link
JP (1) JPS4891981A (da)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005040940A (ja) * 2003-06-13 2005-02-17 Agilent Technol Inc 大規模並列処理微小電気機械システムのパッケージング用に反応性フォイルを用いたウェハボンディング法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005040940A (ja) * 2003-06-13 2005-02-17 Agilent Technol Inc 大規模並列処理微小電気機械システムのパッケージング用に反応性フォイルを用いたウェハボンディング法

Similar Documents

Publication Publication Date Title
FR2177899A3 (da)
FR2184294A5 (da)
FR2199099A1 (da)
JPS4984027U (da)
JPS5124293Y2 (da)
CS154093B1 (da)
CS161541B1 (da)
JPS4997171U (da)
CS159423B1 (da)
CS152733B1 (da)
CS157406B1 (da)
CS155444B1 (da)
JPS49101562U (da)
CS157306B1 (da)
CS161385B1 (da)
CS157334B1 (da)
CS160852B1 (da)
CS157342B1 (da)
CS157933B1 (da)
CS157427B1 (da)
CS157410B1 (da)
BG18373A1 (da)
CH579538A5 (da)
BG22072A3 (da)
BG18499A1 (da)