JPS4891981A - - Google Patents
Info
- Publication number
- JPS4891981A JPS4891981A JP2431272A JP2431272A JPS4891981A JP S4891981 A JPS4891981 A JP S4891981A JP 2431272 A JP2431272 A JP 2431272A JP 2431272 A JP2431272 A JP 2431272A JP S4891981 A JPS4891981 A JP S4891981A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electrodes Of Semiconductors (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2431272A JPS4891981A (da) | 1972-03-08 | 1972-03-08 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2431272A JPS4891981A (da) | 1972-03-08 | 1972-03-08 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS4891981A true JPS4891981A (da) | 1973-11-29 |
Family
ID=12134646
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2431272A Pending JPS4891981A (da) | 1972-03-08 | 1972-03-08 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS4891981A (da) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005040940A (ja) * | 2003-06-13 | 2005-02-17 | Agilent Technol Inc | 大規模並列処理微小電気機械システムのパッケージング用に反応性フォイルを用いたウェハボンディング法 |
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1972
- 1972-03-08 JP JP2431272A patent/JPS4891981A/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005040940A (ja) * | 2003-06-13 | 2005-02-17 | Agilent Technol Inc | 大規模並列処理微小電気機械システムのパッケージング用に反応性フォイルを用いたウェハボンディング法 |