JPS4890478A - - Google Patents

Info

Publication number
JPS4890478A
JPS4890478A JP2187772A JP2187772A JPS4890478A JP S4890478 A JPS4890478 A JP S4890478A JP 2187772 A JP2187772 A JP 2187772A JP 2187772 A JP2187772 A JP 2187772A JP S4890478 A JPS4890478 A JP S4890478A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2187772A
Other languages
Japanese (ja)
Other versions
JPS5313950B2 (US06605200-20030812-C00035.png
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2187772A priority Critical patent/JPS5313950B2/ja
Publication of JPS4890478A publication Critical patent/JPS4890478A/ja
Publication of JPS5313950B2 publication Critical patent/JPS5313950B2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Dicing (AREA)
  • Die Bonding (AREA)
JP2187772A 1972-03-02 1972-03-02 Expired JPS5313950B2 (US06605200-20030812-C00035.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2187772A JPS5313950B2 (US06605200-20030812-C00035.png) 1972-03-02 1972-03-02

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2187772A JPS5313950B2 (US06605200-20030812-C00035.png) 1972-03-02 1972-03-02

Publications (2)

Publication Number Publication Date
JPS4890478A true JPS4890478A (US06605200-20030812-C00035.png) 1973-11-26
JPS5313950B2 JPS5313950B2 (US06605200-20030812-C00035.png) 1978-05-13

Family

ID=12067341

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2187772A Expired JPS5313950B2 (US06605200-20030812-C00035.png) 1972-03-02 1972-03-02

Country Status (1)

Country Link
JP (1) JPS5313950B2 (US06605200-20030812-C00035.png)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60173848A (ja) * 1984-02-20 1985-09-07 Toshiba Seiki Kk ダイボンデイング装置
US4775085A (en) * 1985-10-04 1988-10-04 Mitsubishi Denki Kabushiki Kaisha Semiconductor wafer breaking apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60173848A (ja) * 1984-02-20 1985-09-07 Toshiba Seiki Kk ダイボンデイング装置
US4775085A (en) * 1985-10-04 1988-10-04 Mitsubishi Denki Kabushiki Kaisha Semiconductor wafer breaking apparatus

Also Published As

Publication number Publication date
JPS5313950B2 (US06605200-20030812-C00035.png) 1978-05-13

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