JPS4888884A - - Google Patents
Info
- Publication number
- JPS4888884A JPS4888884A JP47018038A JP1803872A JPS4888884A JP S4888884 A JPS4888884 A JP S4888884A JP 47018038 A JP47018038 A JP 47018038A JP 1803872 A JP1803872 A JP 1803872A JP S4888884 A JPS4888884 A JP S4888884A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Led Device Packages (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP47018038A JPS5748869B2 (US08177716-20120515-C00003.png) | 1972-02-23 | 1972-02-23 | |
| US410524A US3909620A (en) | 1972-02-23 | 1973-10-29 | Time controlled switching system with override control of manual operation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP47018038A JPS5748869B2 (US08177716-20120515-C00003.png) | 1972-02-23 | 1972-02-23 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58120362A Division JPS5936980A (ja) | 1983-07-04 | 1983-07-04 | セラミック配線基板とその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4888884A true JPS4888884A (US08177716-20120515-C00003.png) | 1973-11-21 |
| JPS5748869B2 JPS5748869B2 (US08177716-20120515-C00003.png) | 1982-10-19 |
Family
ID=11960493
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP47018038A Expired JPS5748869B2 (US08177716-20120515-C00003.png) | 1972-02-23 | 1972-02-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5748869B2 (US08177716-20120515-C00003.png) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50148859A (US08177716-20120515-C00003.png) * | 1974-05-20 | 1975-11-28 | ||
| JPS5175178U (US08177716-20120515-C00003.png) * | 1974-12-10 | 1976-06-12 | ||
| JPS51107281U (US08177716-20120515-C00003.png) * | 1975-02-25 | 1976-08-27 | ||
| JPS55146995A (en) * | 1980-04-07 | 1980-11-15 | Nippon Electric Co | Semiconductor device |
| JPS56124248A (en) * | 1981-02-23 | 1981-09-29 | Nec Corp | Semiconductor device |
| JPS6063957A (ja) * | 1983-09-17 | 1985-04-12 | Toshiba Corp | イメ−ジセンサ |
| JPS60263483A (ja) * | 1984-06-12 | 1985-12-26 | Sanyo Electric Co Ltd | 発光ダイオ−ド配列体 |
| JPH0313742U (US08177716-20120515-C00003.png) * | 1989-06-26 | 1991-02-12 |
-
1972
- 1972-02-23 JP JP47018038A patent/JPS5748869B2/ja not_active Expired
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50148859A (US08177716-20120515-C00003.png) * | 1974-05-20 | 1975-11-28 | ||
| JPS5516473B2 (US08177716-20120515-C00003.png) * | 1974-05-20 | 1980-05-02 | ||
| JPS5175178U (US08177716-20120515-C00003.png) * | 1974-12-10 | 1976-06-12 | ||
| JPS51107281U (US08177716-20120515-C00003.png) * | 1975-02-25 | 1976-08-27 | ||
| JPS55146995A (en) * | 1980-04-07 | 1980-11-15 | Nippon Electric Co | Semiconductor device |
| JPS5937598B2 (ja) * | 1980-04-07 | 1984-09-11 | 日本電気株式会社 | 半導体装置 |
| JPS56124248A (en) * | 1981-02-23 | 1981-09-29 | Nec Corp | Semiconductor device |
| JPS6351386B2 (US08177716-20120515-C00003.png) * | 1981-02-23 | 1988-10-13 | Nippon Electric Co | |
| JPS6063957A (ja) * | 1983-09-17 | 1985-04-12 | Toshiba Corp | イメ−ジセンサ |
| JPS60263483A (ja) * | 1984-06-12 | 1985-12-26 | Sanyo Electric Co Ltd | 発光ダイオ−ド配列体 |
| JPH0313742U (US08177716-20120515-C00003.png) * | 1989-06-26 | 1991-02-12 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5748869B2 (US08177716-20120515-C00003.png) | 1982-10-19 |
