JPS4888197A - - Google Patents

Info

Publication number
JPS4888197A
JPS4888197A JP1894072A JP1894072A JPS4888197A JP S4888197 A JPS4888197 A JP S4888197A JP 1894072 A JP1894072 A JP 1894072A JP 1894072 A JP1894072 A JP 1894072A JP S4888197 A JPS4888197 A JP S4888197A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1894072A
Other languages
Japanese (ja)
Other versions
JPS5146159B2 (US07608600-20091027-C00054.png
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1894072A priority Critical patent/JPS5146159B2/ja
Priority to GB903473A priority patent/GB1418169A/en
Priority to DE19732309062 priority patent/DE2309062C3/de
Publication of JPS4888197A publication Critical patent/JPS4888197A/ja
Priority to US05/594,870 priority patent/US4035189A/en
Publication of JPS5146159B2 publication Critical patent/JPS5146159B2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
JP1894072A 1972-02-25 1972-02-25 Expired JPS5146159B2 (US07608600-20091027-C00054.png)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP1894072A JPS5146159B2 (US07608600-20091027-C00054.png) 1972-02-25 1972-02-25
GB903473A GB1418169A (en) 1972-02-25 1973-02-23 Resist image formation process and resin compositions and materials for use in said process
DE19732309062 DE2309062C3 (de) 1972-02-25 1973-02-23 Verfahren zur Herstellung von Reliefbildern und dafür brauchbare Gemische und Aufzeichnungsmaterialien
US05/594,870 US4035189A (en) 1972-02-25 1975-07-10 Image forming curable resin compositions

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1894072A JPS5146159B2 (US07608600-20091027-C00054.png) 1972-02-25 1972-02-25

Publications (2)

Publication Number Publication Date
JPS4888197A true JPS4888197A (US07608600-20091027-C00054.png) 1973-11-19
JPS5146159B2 JPS5146159B2 (US07608600-20091027-C00054.png) 1976-12-07

Family

ID=11985626

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1894072A Expired JPS5146159B2 (US07608600-20091027-C00054.png) 1972-02-25 1972-02-25

Country Status (1)

Country Link
JP (1) JPS5146159B2 (US07608600-20091027-C00054.png)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55127097A (en) * 1979-03-20 1980-10-01 Matsushita Electric Ind Co Ltd Photocurable resin composition and solder resist
JPH02262150A (ja) * 1989-03-31 1990-10-24 Toshiba Corp パターン形成方法
JP2001303012A (ja) * 2000-04-25 2001-10-31 Hitachi Chem Co Ltd 接着剤組成物、回路接続用接着剤組成物、接続体及び半導体装置
JP2001329240A (ja) * 2000-05-23 2001-11-27 Hitachi Chem Co Ltd 接着剤組成物、回路接続用接着剤組成物、回路接続材料、接続体及び半導体装置
JP2014047278A (ja) * 2012-08-31 2014-03-17 Sumitomo Chemical Co Ltd 高分子化合物、及び該高分子化合物を含む絶縁層材料
JP2014162778A (ja) * 2013-02-27 2014-09-08 Eiweiss Kk 化合物、その製造方法および光塩基発生剤組成物

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55127097A (en) * 1979-03-20 1980-10-01 Matsushita Electric Ind Co Ltd Photocurable resin composition and solder resist
JPS6148800B2 (US07608600-20091027-C00054.png) * 1979-03-20 1986-10-25 Matsushita Electric Ind Co Ltd
JPH02262150A (ja) * 1989-03-31 1990-10-24 Toshiba Corp パターン形成方法
JP2001303012A (ja) * 2000-04-25 2001-10-31 Hitachi Chem Co Ltd 接着剤組成物、回路接続用接着剤組成物、接続体及び半導体装置
JP2001329240A (ja) * 2000-05-23 2001-11-27 Hitachi Chem Co Ltd 接着剤組成物、回路接続用接着剤組成物、回路接続材料、接続体及び半導体装置
JP2014047278A (ja) * 2012-08-31 2014-03-17 Sumitomo Chemical Co Ltd 高分子化合物、及び該高分子化合物を含む絶縁層材料
JP2014162778A (ja) * 2013-02-27 2014-09-08 Eiweiss Kk 化合物、その製造方法および光塩基発生剤組成物

Also Published As

Publication number Publication date
JPS5146159B2 (US07608600-20091027-C00054.png) 1976-12-07

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