JPS4885080A - - Google Patents
Info
- Publication number
- JPS4885080A JPS4885080A JP47014806A JP1480672A JPS4885080A JP S4885080 A JPS4885080 A JP S4885080A JP 47014806 A JP47014806 A JP 47014806A JP 1480672 A JP1480672 A JP 1480672A JP S4885080 A JPS4885080 A JP S4885080A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP47014806A JPS4885080A (cs) | 1972-02-14 | 1972-02-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP47014806A JPS4885080A (cs) | 1972-02-14 | 1972-02-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS4885080A true JPS4885080A (cs) | 1973-11-12 |
Family
ID=11871271
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP47014806A Pending JPS4885080A (cs) | 1972-02-14 | 1972-02-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS4885080A (cs) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015060924A (ja) * | 2013-09-18 | 2015-03-30 | 株式会社日立ハイテクインスツルメンツ | フリップチップボンダ及びボンディング方法 |
-
1972
- 1972-02-14 JP JP47014806A patent/JPS4885080A/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015060924A (ja) * | 2013-09-18 | 2015-03-30 | 株式会社日立ハイテクインスツルメンツ | フリップチップボンダ及びボンディング方法 |