JPS4883779A - - Google Patents

Info

Publication number
JPS4883779A
JPS4883779A JP1374272A JP1374272A JPS4883779A JP S4883779 A JPS4883779 A JP S4883779A JP 1374272 A JP1374272 A JP 1374272A JP 1374272 A JP1374272 A JP 1374272A JP S4883779 A JPS4883779 A JP S4883779A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1374272A
Other languages
Japanese (ja)
Other versions
JPS5128498B2 (enrdf_load_html_response
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP47013742A priority Critical patent/JPS5128498B2/ja
Publication of JPS4883779A publication Critical patent/JPS4883779A/ja
Publication of JPS5128498B2 publication Critical patent/JPS5128498B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member

Landscapes

  • Die Bonding (AREA)
JP47013742A 1972-02-07 1972-02-07 Expired JPS5128498B2 (enrdf_load_html_response)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP47013742A JPS5128498B2 (enrdf_load_html_response) 1972-02-07 1972-02-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP47013742A JPS5128498B2 (enrdf_load_html_response) 1972-02-07 1972-02-07

Publications (2)

Publication Number Publication Date
JPS4883779A true JPS4883779A (enrdf_load_html_response) 1973-11-08
JPS5128498B2 JPS5128498B2 (enrdf_load_html_response) 1976-08-19

Family

ID=11841699

Family Applications (1)

Application Number Title Priority Date Filing Date
JP47013742A Expired JPS5128498B2 (enrdf_load_html_response) 1972-02-07 1972-02-07

Country Status (1)

Country Link
JP (1) JPS5128498B2 (enrdf_load_html_response)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS519682A (enrdf_load_html_response) * 1974-07-15 1976-01-26 Nippon Electric Co
JPS5394074U (enrdf_load_html_response) * 1976-12-28 1978-08-01
JPS5412365U (enrdf_load_html_response) * 1977-06-27 1979-01-26
JPS5640254A (en) * 1979-08-06 1981-04-16 Teccor Electronics Inc Semiconductor unit and production thereof
JP2011032336A (ja) * 2009-07-31 2011-02-17 Kansai Paint Co Ltd プルラン誘導体及び有機溶剤型塗料組成物

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6265001U (enrdf_load_html_response) * 1985-10-12 1987-04-22

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS519682A (enrdf_load_html_response) * 1974-07-15 1976-01-26 Nippon Electric Co
JPS5394074U (enrdf_load_html_response) * 1976-12-28 1978-08-01
JPS5412365U (enrdf_load_html_response) * 1977-06-27 1979-01-26
JPS5640254A (en) * 1979-08-06 1981-04-16 Teccor Electronics Inc Semiconductor unit and production thereof
JP2011032336A (ja) * 2009-07-31 2011-02-17 Kansai Paint Co Ltd プルラン誘導体及び有機溶剤型塗料組成物

Also Published As

Publication number Publication date
JPS5128498B2 (enrdf_load_html_response) 1976-08-19

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