JPS4883777A - - Google Patents
Info
- Publication number
- JPS4883777A JPS4883777A JP48008295A JP829573A JPS4883777A JP S4883777 A JPS4883777 A JP S4883777A JP 48008295 A JP48008295 A JP 48008295A JP 829573 A JP829573 A JP 829573A JP S4883777 A JPS4883777 A JP S4883777A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/10—Arrangements for heating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR7202049A FR2168230B1 (en:Method) | 1972-01-21 | 1972-01-21 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4883777A true JPS4883777A (en:Method) | 1973-11-08 |
| JPS5754943B2 JPS5754943B2 (en:Method) | 1982-11-20 |
Family
ID=9092253
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP48008295A Expired JPS5754943B2 (en:Method) | 1972-01-21 | 1973-01-20 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US3826953A (en:Method) |
| JP (1) | JPS5754943B2 (en:Method) |
| DE (1) | DE2302704A1 (en:Method) |
| FR (1) | FR2168230B1 (en:Method) |
| GB (1) | GB1397713A (en:Method) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2563050B1 (fr) * | 1984-04-13 | 1987-01-16 | Thomson Csf | Combineur compact de dispositifs semiconducteurs, fonctionnant en hyperfrequences |
| EP0216090A1 (de) * | 1985-08-30 | 1987-04-01 | Siemens Aktiengesellschaft | Gehäuse für ein im Betrieb Verlustwärme abgebendes Schaltungsbauteil |
| US4954876A (en) * | 1988-08-01 | 1990-09-04 | Sundstrand Corporation | Hermetically sealed compression bonded circuit assembly having flexible walls at points of application of pressure for compression bonding circuit elements |
| US5034803A (en) * | 1988-08-01 | 1991-07-23 | Sundstrand Corporation | Compression bonded semiconductor device having a plurality of stacked hermetically sealed circuit assemblies |
| US4985752A (en) * | 1988-08-01 | 1991-01-15 | Sundstrand Corporation | Hermetically sealed compression bonded circuit assembly having a suspension for compression bonded semiconductor elements |
| US4830979A (en) * | 1988-08-01 | 1989-05-16 | Sundstrand Corp. | Method of manufacturing hermetically sealed compression bonded circuit assemblies |
| US5001299A (en) * | 1989-04-17 | 1991-03-19 | Explosive Fabricators, Inc. | Explosively formed electronic packages |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL94441C (en:Method) * | 1951-09-15 | |||
| US3320497A (en) * | 1964-09-11 | 1967-05-16 | Control Data Corp | Variable capacitance diode packages |
| US3374533A (en) * | 1965-05-26 | 1968-03-26 | Sprague Electric Co | Semiconductor mounting and assembly method |
| US3278763A (en) * | 1965-08-23 | 1966-10-11 | Hewlett Packard Co | Two diode balanced signal sampling apparatus |
| US3483444A (en) * | 1967-12-06 | 1969-12-09 | Int Rectifier Corp | Common housing for independent semiconductor devices |
| US3519888A (en) * | 1968-08-12 | 1970-07-07 | Int Rectifier Corp | High voltage stack having metallic enclosure |
-
1972
- 1972-01-21 FR FR7202049A patent/FR2168230B1/fr not_active Expired
-
1973
- 1973-01-16 US US00324144A patent/US3826953A/en not_active Expired - Lifetime
- 1973-01-18 GB GB271773A patent/GB1397713A/en not_active Expired
- 1973-01-19 DE DE2302704A patent/DE2302704A1/de not_active Ceased
- 1973-01-20 JP JP48008295A patent/JPS5754943B2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| GB1397713A (en) | 1975-06-18 |
| JPS5754943B2 (en:Method) | 1982-11-20 |
| FR2168230B1 (en:Method) | 1974-09-13 |
| DE2302704A1 (de) | 1973-07-26 |
| US3826953A (en) | 1974-07-30 |
| FR2168230A1 (en:Method) | 1973-08-31 |