JPS4878876A - - Google Patents
Info
- Publication number
- JPS4878876A JPS4878876A JP759272A JP759272A JPS4878876A JP S4878876 A JPS4878876 A JP S4878876A JP 759272 A JP759272 A JP 759272A JP 759272 A JP759272 A JP 759272A JP S4878876 A JPS4878876 A JP S4878876A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/1012—Auxiliary members for bump connectors, e.g. spacers
- H01L2224/10152—Auxiliary members for bump connectors, e.g. spacers being formed on an item to be connected not being a semiconductor or solid-state body
- H01L2224/10175—Flow barriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/8119—Arrangement of the bump connectors prior to mounting
- H01L2224/81193—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed on both the semiconductor or solid-state body and another item or body to be connected to the semiconductor or solid-state body
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP759272A JPS5434313B2 (en) | 1972-01-21 | 1972-01-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP759272A JPS5434313B2 (en) | 1972-01-21 | 1972-01-21 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4878876A true JPS4878876A (en) | 1973-10-23 |
| JPS5434313B2 JPS5434313B2 (en) | 1979-10-25 |
Family
ID=11670066
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP759272A Expired JPS5434313B2 (en) | 1972-01-21 | 1972-01-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5434313B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50112784A (en) * | 1974-02-18 | 1975-09-04 |
-
1972
- 1972-01-21 JP JP759272A patent/JPS5434313B2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50112784A (en) * | 1974-02-18 | 1975-09-04 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5434313B2 (en) | 1979-10-25 |