JPS4876935A - - Google Patents
Info
- Publication number
- JPS4876935A JPS4876935A JP47007105A JP710572A JPS4876935A JP S4876935 A JPS4876935 A JP S4876935A JP 47007105 A JP47007105 A JP 47007105A JP 710572 A JP710572 A JP 710572A JP S4876935 A JPS4876935 A JP S4876935A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Manufacturing Of Micro-Capsules (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP710572A JPS5431468B2 (cs) | 1972-01-17 | 1972-01-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP710572A JPS5431468B2 (cs) | 1972-01-17 | 1972-01-17 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4876935A true JPS4876935A (cs) | 1973-10-16 |
| JPS5431468B2 JPS5431468B2 (cs) | 1979-10-06 |
Family
ID=11656794
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP710572A Expired JPS5431468B2 (cs) | 1972-01-17 | 1972-01-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5431468B2 (cs) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50103537A (cs) * | 1974-01-21 | 1975-08-15 | ||
| JPS57209978A (en) * | 1981-04-21 | 1982-12-23 | Kiyapushiyureetetsudo Shisutem | Microencapsulated epoxy adhesive |
| EP0672707A3 (en) * | 1994-03-15 | 1996-07-03 | Toray Industries | Encapsulated curing agent for thermosetting resin compositions. |
| CN110591048A (zh) * | 2019-09-23 | 2019-12-20 | 安徽大学 | 一种含氟水性环氧固化剂的制备方法 |
-
1972
- 1972-01-17 JP JP710572A patent/JPS5431468B2/ja not_active Expired
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50103537A (cs) * | 1974-01-21 | 1975-08-15 | ||
| JPS57209978A (en) * | 1981-04-21 | 1982-12-23 | Kiyapushiyureetetsudo Shisutem | Microencapsulated epoxy adhesive |
| EP0672707A3 (en) * | 1994-03-15 | 1996-07-03 | Toray Industries | Encapsulated curing agent for thermosetting resin compositions. |
| US5589523A (en) * | 1994-03-15 | 1996-12-31 | Toray Industries, Inc. | Microcapsule-type curing agent, method for producing the same, thermosetting resin composition, prepreg and fiber reinforced composite material |
| CN110591048A (zh) * | 2019-09-23 | 2019-12-20 | 安徽大学 | 一种含氟水性环氧固化剂的制备方法 |
| CN110591048B (zh) * | 2019-09-23 | 2021-07-30 | 安徽大学 | 一种含氟水性环氧固化剂的制备方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5431468B2 (cs) | 1979-10-06 |