JPS487643Y1 - - Google Patents
Info
- Publication number
- JPS487643Y1 JPS487643Y1 JP11226169U JP11226169U JPS487643Y1 JP S487643 Y1 JPS487643 Y1 JP S487643Y1 JP 11226169 U JP11226169 U JP 11226169U JP 11226169 U JP11226169 U JP 11226169U JP S487643 Y1 JPS487643 Y1 JP S487643Y1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11226169U JPS487643Y1 (es) | 1969-11-25 | 1969-11-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11226169U JPS487643Y1 (es) | 1969-11-25 | 1969-11-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS487643Y1 true JPS487643Y1 (es) | 1973-02-27 |
Family
ID=33272212
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11226169U Expired JPS487643Y1 (es) | 1969-11-25 | 1969-11-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS487643Y1 (es) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020500425A (ja) * | 2016-11-03 | 2020-01-09 | ロヒンニ リミテッド ライアビリティ カンパニー | 半導体デバイスの直接移送に適合する針 |
| US11488940B2 (en) | 2015-03-20 | 2022-11-01 | Rohinni, Inc. | Method for transfer of semiconductor devices onto glass substrates |
| US11728195B2 (en) | 2018-09-28 | 2023-08-15 | Rohinni, Inc. | Apparatuses for executing a direct transfer of a semiconductor device die disposed on a first substrate to a second substrate |
-
1969
- 1969-11-25 JP JP11226169U patent/JPS487643Y1/ja not_active Expired
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11488940B2 (en) | 2015-03-20 | 2022-11-01 | Rohinni, Inc. | Method for transfer of semiconductor devices onto glass substrates |
| US11515293B2 (en) | 2015-03-20 | 2022-11-29 | Rohinni, LLC | Direct transfer of semiconductor devices from a substrate |
| US11562990B2 (en) | 2015-03-20 | 2023-01-24 | Rohinni, Inc. | Systems for direct transfer of semiconductor device die |
| JP2020500425A (ja) * | 2016-11-03 | 2020-01-09 | ロヒンニ リミテッド ライアビリティ カンパニー | 半導体デバイスの直接移送に適合する針 |
| US11728195B2 (en) | 2018-09-28 | 2023-08-15 | Rohinni, Inc. | Apparatuses for executing a direct transfer of a semiconductor device die disposed on a first substrate to a second substrate |