JPS4871181A - - Google Patents

Info

Publication number
JPS4871181A
JPS4871181A JP10457671A JP10457671A JPS4871181A JP S4871181 A JPS4871181 A JP S4871181A JP 10457671 A JP10457671 A JP 10457671A JP 10457671 A JP10457671 A JP 10457671A JP S4871181 A JPS4871181 A JP S4871181A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10457671A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10457671A priority Critical patent/JPS4871181A/ja
Publication of JPS4871181A publication Critical patent/JPS4871181A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
JP10457671A 1971-12-24 1971-12-24 Pending JPS4871181A (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10457671A JPS4871181A (enrdf_load_stackoverflow) 1971-12-24 1971-12-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10457671A JPS4871181A (enrdf_load_stackoverflow) 1971-12-24 1971-12-24

Publications (1)

Publication Number Publication Date
JPS4871181A true JPS4871181A (enrdf_load_stackoverflow) 1973-09-26

Family

ID=14384249

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10457671A Pending JPS4871181A (enrdf_load_stackoverflow) 1971-12-24 1971-12-24

Country Status (1)

Country Link
JP (1) JPS4871181A (enrdf_load_stackoverflow)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3465209A (en) * 1966-07-07 1969-09-02 Rca Corp Semiconductor devices and methods of manufacture thereof
JPS4524260Y1 (enrdf_load_stackoverflow) * 1968-02-14 1970-09-24

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3465209A (en) * 1966-07-07 1969-09-02 Rca Corp Semiconductor devices and methods of manufacture thereof
JPS4524260Y1 (enrdf_load_stackoverflow) * 1968-02-14 1970-09-24

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